Author Archives: TrendForce

[News] ChangXin Memory Technologies in China Has Reportedly Begun Mass Production of HBM2

Posted on 2024-08-06 by TrendForce

According to a report from Tom’s Hardware citing industry sources, it’s indicated that Chinese memory giant ChangXin Memory Technologies (CXMT) has started mass production of HBM2. If confirmed, this is approximately two years ahead of the expected timeline, although the …

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[News] Foxconn Remains Unfazed Despite NVIDIA’s GB200 Delay, with Customers Aim to Secure Their Orders

Posted on 2024-08-05 by TrendForce

According to a report from The Information, NVIDIA’s “world’s most powerful AI chip,” the GB200, is said to be experiencing yield issues, leading to a one-quarter delay in mass shipments. As per sources cited by a report from the Economic Daily …

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[News] NVIDIA’s Backup Plan? Intel Reportedly Secures Packaging Orders from the AI Giant

Posted on 2024-08-05 by TrendForce

As the demand for AI GPUs increases, TSMC’s advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same …

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[News] China Reportedly Collaborates with Tech Giants through Front Companies to Avoid U.S. Sanctions on AI

Posted on 2024-08-05 by TrendForce

Amid the heating tech war between the U.S. and China, and the stringent sanctions imposed to prevent China from obtaining cutting-edge chips, it appears that China is still able to find its way out. According to a report by Tom’s …

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[News] Breaking Apple’s Monopoly – TSMC’s InFO Packaging Reportedly Adds Google Chips

Posted on 2024-08-05 by TrendForce

TSMC’s fan-out (InFO) packaging process will no longer be exclusively used by Apple. According to a report from Commercial Times, it’s revealed that Google’s self-developed Tensor chips for their phones will switch to TSMC’s 3nm process next year and will also start using InFO …

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