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Author Archives: TrendForce
[News] U.S. Initial Jobless Claims Less than Expected, Easing Market Fears of Economic Recession
The U.S. Department of Labor released data on August 8th showing that initial jobless claims for the previous week stood at 233,000, a decrease of 17,000 from the revised figure of the prior week, and better than the market expectation …
[News] AI Chip Manufacturer Black Sesame Listed on Hong Kong Stock Exchange
On August 8, 2024, Black Sesame Technologies, a company specializing in AI chip for smart vehicles, was listed on the Hong Kong Stock Exchange. Founded in 2016, Black Sesame is a provider of automotive-grade intelligent vehicle computing chips and chip-based …
Posted in IC Design, Semiconductors
Tagged AI chip, automotive, Black Sesame Technologies, China, Hong Kong, self-driving cars
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[News] Samsung to Intensify Efforts for Capturing Intel’s Advanced Packaging Orders Shifting from TSMC
According to a report from The Chosun Daily, major tech companies like NVIDIA are considering using Intel’s foundry services (IFS) as an alternative due to TSMC’s packaging capacity shortages. While packaging is a core competency for semiconductor foundries, Samsung, which …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged 3nm, advanced packaging, CoWoS, Foveros, Google, Intel, Qualcomm, Samsung, TSMC
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[News] Intel Reportedly Rejected OpenAI Investment, Missing Out on AI Opportunity
According to a report from Reuters citing sources on August 7th, American chip giant Intel had an opportunity to invest in OpenAI several years ago but ultimately had the investment rejected by company executives, resulting in a missed opportunity. Reportedly, …
[News] HP’s PC Manufacturing Site Shift Has Put the Spotlight on Quanta & Inventec’s Subsequent Plans
While HP is making a move to withdraw over half of its PC production lines from China, according to a report from Economic Daily News, ODM such as Quanta and Inventec have already started setting up operations in Thailand to address …