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Author Archives: TrendForce
[News] TSMC’s N3 Process Fuels High Demand, as Supply Chain Expected to Boom Through Next Year
According to a report from Commercial Times, TSMC’s advanced processes continue to experience strong demand, with major tech companies such as Apple, Qualcomm, NVIDIA, and AMD nearly fully booking TSMC’s 3nm capacity, while the order visibility extends into 2025. As …
Posted in Semiconductors, Wafer Foundries
Tagged 3nm, AMD, Apple, N3, Nvidia, Qualcomm, TSMC
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[News] JCET’s New High-End Packaging Plant in China Reportedly to Start Production Soon
According to a report from UDN, China’s largest semiconductor packaging and testing company, JCET, has completed the planning and verification work for the first phase of the “JCET Microelectronics Wafer-level Microsystems Integration High-end Manufacturing Project.” The project will soon be completed …
Posted in Consumer Electronics, Semiconductors
Tagged 5G, advanced packaging, AI, China, JCET
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[News] Samsung Reportedly Emerges as a New Option other than TSMC for Chinese Clients as US Election Approaches
With the U.S.-China tech war heating up as the U.S. election approaches, industry sources cited by the Economic Daily News report that Chinese IC design companies are rushing to place more orders with TSMC for chip production using advanced processes before …
Posted in IC Design, Semiconductors
Tagged advanced process, China, IC design, Samsung, Taiwan, TSMC, US
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[News] SK hynix is Reportedly Considering U.S. IPO for its NAND/SSD Subsidiary Solidigm
South Korean memory giant SK hynix, after announcing soaring financial results in Q2 and its massive investment in Yongin Semiconductor Cluster last week, is now reportedly considering another move: US IPO for its Solidigm subsidiary. According to the reports by …
[News] TSMC’s German Plant Reported to Break Ground in Weeks, Expected to Begin Production by Late 2027
TSMC announced last year that it would build a plant in Dresden, Germany. The plant is originally expected to break ground as early as Q4 this year, but now it may start sooner. According to a report from Deutsche Welle, …
Posted in IC Manufacturing, Package&Test, Semiconductors
Tagged Bosch, Europe, Germany, Infineon, NXP, semiconductor, TSMC
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