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Author Archives: tomaslin
[News] OpenAI in Talks with Broadcom, Starting a AI Chip Plan with USD 7 Trillion
According to a report from The Information, generative AI application giant OpenAI has held talks with several chip designers, including Broadcom, to discuss plans for developing new AI chip. It’s reported that OpenAI is currently exploring the possibility of manufacturing …
[News] The HBM4 Battle Begins! Memory Stacking Challenges Remain, Hybrid Bonding as the Key Breakthrough
According to a report from TechNews, South Korean memory giant SK Hynix is participating in COMPUTEX 2024 for the first time, showcasing the latest HBM3e memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealing that hybrid bonding will play …
Posted in DRAM, Semiconductors
Tagged HBM, HBM3e, HBM4, memory, Micron, Samsung, SK Hynix
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[News] Apple M4 Incoming, Boosting TSMC’s 3nm Production
In a bid to seize the AI PC market opportunity, Apple is set to debut its new iPad Pro on the 7th, featuring its in-house M4 chip. With the momentum of the M4 chip’s strong debut, Apple reportedly plans to …
Posted in Consumer Electronics, Notebook Computers
Tagged 3nm, AI PC, Apple, N3E, TSMC
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[News] Intel, Qualcomm, Google Reportedly Form Alliance, Posing Challenges to NVIDIA’s Dominance in AI?
Intel, Qualcomm, Google, and other tech giants are reportedly joining forces with over a hundred startups to challenge NVIDIA’s dominance in the market, as per a report from Reuters. Reportedly, their goal is to collectively penetrate the artificial intelligence (AI) …
[News] Samsung and Naver Jointly Invest in New AI Chip, as Naver Reportedly Claiming an Eightfold Performance Boost Compared to NVIDIA H100
Samsung Electronics and South Korean internet giant Naver have joined forces to invest in an artificial intelligence semiconductor solution. According to BusinessKorea’s report, the energy efficiency of the first solution chip from the two companies is expected to be roughly …