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Recent Posts
- [News] AI Chip Firm Cambricon Poised as China’s Top Stock of 2024 with Nearly 400% Surge, Surpassing NVIDIA
- [News] Chinese DRAM Giant CXMT Reportedly Achieves 80% DDR5 Yield, Targeting 90% by 2025
- [News] China’s Phytium Hits 10 Million CPU Sales as U.S. Chips Face Government Ban
- [News] Apple May Delay Adopting TSMC’s 2nm Node Until its Capacity Grows Eightfold in 2026
- [News] TSMC Advances in Silicon Photonics: Broadcom and NVIDIA Set to Be First Customers
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Author Archives: TrendForce
LCD TV Panel Pricing Falls to New Lows, Panel Factories Must Reduce Production
According to TrendForce, based on the quarterly supply-demand ratio, the difference in supply and demand in 1Q22 rose by 4.9% to 8.9% compared with 4Q22, much higher than supply and demand equilibrium at 5%. However, since panel makers still had …
[Chip War] Irrespective of US sanctions and the Pandemic, China’s IC sales to Grow by Another 11% in 2022
In recent years, China’s IC sales have been increasing year over year. Although sales have been suppressed by the United States and the impact of the pandemic, China’s IC sales still increased by 17% in 2020. Benefiting from the development …
Posted in Semiconductors, Wafer Foundries
Tagged foundry, HHGrace, Hua Hong, SMIC, trade war, TrendForce
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Sony to Ramp Up PS5 Console Production, Aiming to Boost Sales to 18 million units in New Fiscal Year
Sony stated in an earnings call that PS5 shipments totaled only 11.5 million units in the last fiscal year (2Q21 to 1Q22), missing the target of 14.8 million units. Increasing PS5 game console production will be the company’s main task …
Posted in Consumer Electronics, Others
Tagged console game, Microsoft, Nintendo Switch, PS5, Sony, Xbox Series X
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Global Packaging and Testing Output Value Reached US$82.139 Billion in 2021, 25.83% YoY, China Becomes Fastest Growing Market
According to TrendForce research, driven by strong demand for 5G mobile phones, base stations, automobiles, and HPCs, the global output value of packaging and testing (including foundry and IDM) reached US$82.139 billion in 2021, or 25.83% YoY. This upward momentum …
Posted in Semiconductors, Wafer Foundries
Tagged advanced packaging, Amkor, ASE, IC packaging, TrendForce, wafer
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Smartphone Panel Shipments Forecast to reach 1.872 billion in 2022, Chinese Companies Accounting for More Than 50%
According to TrendForce research, after smartphone panel shipments peaked at 1.95 billion in 2018, overall shipments declined gradually year over year. After 2020, due to the impact of the COVID-19 pandemic, shipments fell sharply to 1.796 billion units. In 2021, …