Author Archives: TrendForce

Price Drop of NAND Flash Products for 1Q22 Expected to Taper to 8-13% QoQ Decline, Says TrendForce

Posted on 2022-01-24 by TrendForce

NAND Flash prices for 1Q22 are expected to decline by 8-13% QoQ, compared to TrendForce’s previous forecast of 10-15% QoQ, primarily due to PC OEMs’ increased orders for PCIe 3.0 products and the impact of the lockdown in Xi’an on PC …

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Locked Onto Home Theater and High-End Commercial Display Markets, Revenue of Micro LED Large-sized Display Chips Will Reach US$4.5 Billion in 2026, Says TrendForce

Posted on 2022-01-19 by TrendForce

Micro LED large-sized displays will move towards the home theater and high-end commercial display markets and the revenue of Micro LED large-sized display chips is estimated to reach US$54 million in 2022, according to TrendForce’s latest research. By 2026, revenue is …

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As Pandemic Resurges, Certain Productions Lines Suspended at Murata Fukui Takefu but Yet to Affect Production or Shipping, Says Trendforce

Posted on 2022-01-18 by TrendForce

The allocation of Murata’s primary production hubs and production capacity is as follows: 56% in Japan, 36% in China, 3% in Singapore, and 5% in the Philippines, according to TrendForce’s investigations. Recently, a cluster of employees at Murata’s Fukui Takefu Plant …

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Effects of Stay-at-Home Economy Retreat, Shipments of Notebooks in 2022 Expected to Reach 238 Million Units, Says TrendForce

Posted on 2022-01-14 by TrendForce

Due to the pandemic, laptops shipments reached a record high of 240 million units in 2021, according to TrendForce‘s investigations. However, the market has been abuzz recently and, as the global population of the fully vaccinated has exceeded 50%, relevant demand …

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Heterogeneous Integration Expected to Become Key Part of Packaging Technology Thanks to Development from EDA Companies

Posted on 2022-01-14 by TrendForce

Although current semiconductor process technologies have evolved to the 3nm and 5nm nodes, SoC (system on a chip) architecture has yet to be manufactured at these nodes, as memory and RF front-end chiplets are yet to reach sufficient advancements in …

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Posted in IC Manufacturing, Package&Test, Semiconductors | Tagged , , , , , , , | Leave a comment