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DRAMeXchange, a division of TrendForce, anticipates that 3D-NAND will formally become the mainstream architecture of NAND Flash memory in the third quarter of 2017 with its share in the total NAND Flash bit output exceeding 50%. Following the footsteps of the leading 3D-NAND producers Samsung and Micron, most NAND Flash suppliers will begin mass production of 64-layer 3D-NAND chips in the second half of 2017. Nonetheless, the overall NAND Flash supply is expected to remain tight through the year due to Apple stocking up components for the next iPhone release and steady demand growth from SSD vendors.
WitsView, a division of TrendForce, reports LCD TV panel shipments for this first quarter totaled 60.16 million units, representing a drop of 10.7% compared with the prior quarter but also a year-on-year increase of 0.4%. Looking at major trends in the TV panel market, the growing demand for 4K resolution is accompanying the steady increase in the average panel size. Despite seasonal headwinds, first-quarter shipments of UHD (4K resolution) TV panels went up 0.5% sequentially to reach 20 million units for the first time ever and accounted for 33.3% of the total TV panel shipments.
Among the possible new technologies to be incorporated in this year’s refresh of the iPhone series, 3D sensing has generated a lot of interests in terms of applications. A 3D sensing solution requires an RGB camera module an infrared (IR) sensor module that uses VCSEL (vertical-cavity surface-emitting laser) as a light source. With more high-end smartphones adopt 3D sensing, TrendForce estimates that the worldwide market scale of IR sensor modules for mobile devices will reach US$145 million in 2017.
