The capacity status report is conducted through deep industry research, revealing global panel capacity status and predicting capacity changes in the future. In addition to tracking monthly capacity adjustments, it pays even more attention to the status and trend of new technologies such as LTPS, Oxide, as well as their impacts on global panel supply.
Through accumulating major components' costs, this report analyzes smartphone's mainstream size panels' cost structure and predicts their future cost trend, so that our customers can accurately calculate panel cost structure and products' profitability.
The analysis of Notebook and Tablet panel cost & breakdown is conducted by stacking main component costs, further decomposing panel price structure of various mainstream sizes by applications and predicting future cost trend, which keeps clients updated on panel cost structure and product profitability.
The analysis of Monitor & TV panel cost & breakdown is conducted by stacking main component costs, further decomposing panel price structure of various mainstream sizes by applications and predicting future cost trend, which keeps clients updated on panel cost structure and product profitability.
The key component price tracker focuses on current situtation and future trend of large-sized panel key components, helping clients improve cost control ability on component purchasing.
The quarterly report covers movements of the panel upstream component industry, including component price trend, product development trend, panel techology development trend, and panel cost analysis.
This report contains 2 major sections: industry's“dynamic issues”and “trends of costs & prices”. In the section of "industry's dynamic issues", it analyzes 2 or 3 key topics of driver IC and related supply chain. In "trends of cost and price", it shows the factors that influence price trends and provides the price data of "driver IC", upstream related "foundries", and "packaging & testing".
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