Selected Topics

Selected Topics cover various major fields of the technology industry, including the semiconductor industry, green energy, and terminal devices. These specially selected reports focus on major industries, allowing readers to quickly grasp the technological advancements and trends in each field.

DeepSeek-V4: China's AI Hardware-Software Co-Design Strategy

As technical iteration narrows the capability gap between models, Chinese open-source models are expanding their global presence by compensating weaker hardware with software optimization and scale. Under compute constraints, Chinese models can still maintain solid performance and a strong price–performance advantage, based on a fundamental reshaping of “model design and system engineering.” The launch of DeepSeek‑V4, the first Chinese model to achieve domestic substitution in the inference stage, has become a flagship example, and is driving China’s AI industry to further deepen an integrated “AI hardware–software co‑design” development path.

Optical Interconnect Supply Chain Restructuring and Opportunities in Response to Expanded US Export Controls

As U.S. export controls extend from chips to AI infrastructure, the traditional optical interconnect industry is undergoing supply chain restructuring. While optical modules are not subject to blanket bans, they are now governed by system‑level controls. By leveraging its semiconductor ecosystem and investing in SiPh, CPO, advanced packaging and testing capabilities, Taiwan can capture North American supply‑chain de‑risking demand and reposition itself as a strategic AI partner.

The 2026 Semiconductor Inflection Point: Scaling from 2nm GAA to the Era of ASIC Sovereignty

The semiconductor industry is undergoing a structural shift in 2026, with competition moving beyond process node scaling toward system-level architecture. On the technology front, 2nm gate-all-around (GAA) structures offer ultra-low leakage through full gate control, addressing key challenges in edge AI. Meanwhile, advanced packaging technologies such as CoWoS have evolved into a strategic focal point for defining overall system performance. On the application front, the need for inference is driving the rapid growth of ASICs, as companies like Amazon Web Services, Google, Meta, and Alibaba develop their own architectures and co-optimized software and hardware to regain control over compute resources. At the same time, AI-powered EDA tools are removing productivity hurdles and promoting design democratization, opening new avenues for IC innovation and encouraging wider ASIC adoption.

Defense Tech Transformation: Software-Defined Systems & Taiwan's Supply Chain Positioning

Intensifying global geopolitical conflicts are driving up defense spending, and warfare is pivoting toward asymmetric and information warfare, making low-cost unmanned vehicles (UAVs) crucial. China is deepening military-civilian integration to break through technology controls, while Taiwan is fully developing localized UAV and AI defense supply chains to strengthen resilience.

Crossing AI Memory Wall: Storage Layer Reallocation and HBF Analysis

In AI inference, MoE architectures and long-context processing have sharply increased memory-capacity requirements for model weights and KV cache, shifting the bottleneck from insufficient compute to limited memory capacity. As warm data grows rapidly, this will drive a restructuring of the storage hierarchy, where HBM will handle hot data, while HBF will carry warm data to optimize cost–performance. However, commercialization of HBF still needs to overcome challenges in advanced packaging processes and the inherent characteristics of NAND flash.

The CPO Paradigm Shift in the AI Era: Strategic Opportunities for Taiwan’s Ecosystem and the Future of Interconnect Architecture

With the generative AI market expanding at a CAGR of over 35%, data throughput for a single large language model (LLM) training task has reached the exabyte (EB) level. As transmission speeds evolve toward 1.6Tbps, traditional copper cables are hitting a “physical wall,” limiting transmission distances to under one meter and creating a massive energy drain. Leveraging cross-domain technologies like TSMC’s Compact Universal Photonic Engine (COUPE) advanced packaging and Micro LED mass transfer, Taiwan’s supply chain has built a comprehensive ecosystem—spanning wafer foundries and ASIC design to photoelectric testing. Consequently, Taiwan has become an indispensable strategic hub in the global AI computing infrastructure.

Deconstructing PLP Warpage: Low-Temp PSPI, Balance Films, and Supplier Analysis

For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical window for product validation and deliveries for related equipment and material providers. To address the warpage issues inherent in large-area panel-level packaging (PLP), specialty chemical suppliers such as AMC, WaferChem, and Everlight Chemical showcased corresponding solutions at Touch Taiwan 2026, drawing significant market attention. Accordingly, this report provides an in-depth analysis of: (1) the background of the material technology PLP and its market outlook; (2) the causes of warpage and potential solutions; and (3) warpage-suppressing materials and key suppliers. The objective is to clarify the demand drivers for PLP, the mechanisms behind panel warpage, viable countermeasures, and the emerging business opportunities for Taiwan-based companies.

SiC/GaN Power Semiconductors Break "AI Power Wall," Reshaping Data Center Power Supply

In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale deployment across global infrastructure as AI data centers confront the “power wall” bottleneck and EVs accelerate the adoption of 800V high-voltage architectures.

2026 T-Glass Supply Shortages: AI Rack Fiberglass Trends

NVIDIA once again showcased its Rubin-series chips and rack systems—scheduled for launch by the end of 2026—at GTC 2026 on March 16th. Compared to the previous generation, the Rubin series boasts significantly larger substrate sizes, higher layer counts, and increased rack board complexity. Furthermore, the shift toward cableless design architectures is driving demand for components such as midplanes and orthogonal backplanes, while the introduction of the inference-focused Rubin LPX rack is further boosting demand for high-end glass fiber cloth. However, the supply side is facing severe constraints. Nittobo, which controls approximately 90% of the global T-glass market and 60–70% of the NER-glass market, is not expected to bring new capacity online until mid-2027 at the earliest. This implies that supply gaps for critical materials will persist over the next year, with direct implications for lead times and cost trends across the AI server supply chain. This issue warrants close attention from all industry stakeholders. This report provides an in-depth analysis of: (1) The technology background and development of glass fiber cloth; (2) AI-driven demand trends for glass fiber cloth; (3) Nittobo’s capacity bottlenecks and their impact on pricing. The objective is to offer a comprehensive view of demand momentum, pricing trends, and competitive dynamics in the high-end fiberglass cloth market.
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[News] Micron More Upbeat on Outlook, Reportedly Sets 2027 HBM4E Ramp with TSMC for Standard, Custom Logic Dies
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[News] Micron More Upbeat on Outlook, Reportedly Sets 2027 HBM4E Ramp with TSMC for Standard, Custom Logic Dies
[News] Huawei Reportedly Builds 122TB SSDs With New Packaging Tech Despite Limited 100+ Layer 3D NAND Access
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[News] Huawei Reportedly Builds 122TB SSDs With New Packaging Tech Despite Limited 100+ Layer 3D NAND Access
[News] SMIC, Hua Hong Reportedly Lift Prices Amid AI-Driven Capacity Shifts; Hua Hong Expects More 12-Inch Hikes in 2026
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[News] SMIC, Hua Hong Reportedly Lift Prices Amid AI-Driven Capacity Shifts; Hua Hong Expects More 12-Inch Hikes in 2026

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