AIGC is being comprehensively implemented and gradually entering human life. Currently, major technology companies, leading application service providers, numerous startups, and national institutions are actively involved due to the profound impact anticipated from the application of AIGC. This report primarily focuses on the development of the upstream supply chain in the AIGC industry, specifically on AI framework developers, AI model developers, IC design houses, IC manufacturing, and OSATs, in order to grasp on industry trends.
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing systems, which allows HBM to further exert its abilities. This report probes into the demand background and development tendencies of HBM, and focuses on the 2.5D packaging technology that integrates HBM.
Values of AI servers and corresponding computing cores GPGPU (General-Purpose Computing on Graphics Processing Unit) in parallel computing as LLM (Large Language Model), which excels in NLP (Natural Language Processing), and diffusion model, which excels in image processing, march towards mass commercialization, have become essential drivers for the human society in improving productivity through technical advancement.
Among which, AI servers possess a higher degree of customization compared to that of cloud servers. Taiwanese ODMs, including Foxconn Industrial Internet, Inventec, MiTAC, Wistron, Wiwynn, and Quanta, are once again portraying essential roles in the supply chain for AI servers with their capabilities in customization, while server OEMs such as Dell, Gigabyte, HPE, Lenovo, and Supermicro are relying on AI server solutions as important growth dynamics in the global server market amidst the post-pandemic era.
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore’s Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.
1. Overall Performanc
2. R&D Expenses among IC Design Houses
4. Performance in Other Areas
5. Competition of Smartphone SoC Market
6. TRI’s View
Components adopted with InP, a compound semiconductor material, are higher in drift velocity for saturation electrons, stronger in radiation resistance, better in thermal conductivity, higher in photoelectric conversion efficiency, and higher in band gap. They are thus more promising in applications of optical communication, data centers, new-gen displays, AI, unmanned driving, and aerospace.
InP materials are primarily used for the production of photonic components and microwave RF components. They are capable of emitting and detecting photons at 1,000m and above wavelengths, as well as high-speed and low-noise high frequency RF applications. This report provides an analysis on the photonic component market that is most concatenated with InP.
GaN, with its superior properties such as high breakdown field strength, high saturation electron drift velocity, strong radiation resistance, and good chemical stability, enables the manufacture of optoelectronics, power semiconductors, and high-frequency microwave RF components. This makes GaN ideal for applications including LEDs, transformers, data centers, 5G communications, and EVs.
Growing GaN crystal largely depends on substrates other than GaN—Si, SiC, and Sapphire. This report provides a detailed breakdown of the GaN industry, with a focus on GaN power components, microwave RF components, and raw materials.
The demand for large-size display driver ICs in 2023 is set to increase seasonally with panel demand. However, due to conservative stockpiling by the supply chain, a potential shortage could surface in the latter half of 2023. The issue of smartphone TDDI (Touch and Display Driver Integration) inventory is predicted to ease in 2023, with production largely shifting to Chinese wafer fabs. Over time, IC manufacturers are expected to expand the application of TDDI into medium-sized panels, such as those for tablets and automotive displays. After a brief supply crunch, AMOLED driver ICs will likely face an excess supply in 2023 due to falling demand and rising supply. A key factor to observe will be whether the upcoming 28nm production capacity can sufficiently meet market demand.
Wafer manufacturing involves the use of various semiconductor equipment that can be categorized into more than ten types, such as photolithography machines, etching equipment, and thin-film deposition equipment (PVD/CVD/ALD). These categories can be further divided based on different working principles or processed materials. The production of these machines involves the integration of diverse scientific techniques, including optics, physics, and chemistry, posing high technical barriers and manufacturing difficulties. These machines are also characterized by their significant worth and high investment in research and development.
Chinese companies engaged in the development of wafer manufacturing equipment mainly include NAURA Tech., Advanced Micro, SMEE, Piotech, Hwatsing Tech., etc.
This report primarily discusses the development of China’s semiconductor industry, emphasizing key equipment used in thin-film deposition, etching, and photolithography.
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