Enterprise SSD Datasheet provides you with the latest SSD density and shipment forecast for server equipment and data centers. Also, enterprise SSD interface, form factor breakdown, and read / mixed read / write load / write intensify Enterprise SSD breakdown.
This week’s Bulletin provides an update on the latest dynamics of server ODMs, CPUs, and GPUs, as well as updates on the supply chain of server cooling...
In April, TrendForce initiated quarterly data tracking with the publication of the 2Q25 datasheet. This month’s bulletin provides an analysis of the balance between...
"As demand for AI servers rises, the adoption of HBM4 memory is set to increase costs, with estimated price premiums exceeding 30%. HBM4 features significant changes, including doubling IO channels to 2048 and using logic chip architecture, leading to higher data transfer rates and reduced latency. However, these advancements also raise manufacturing costs, with wafer costs reaching $7000-8000, making it 3-4 times more expensive than traditional DRAM. In 2026, total HBM shipments are forecasted to exceed 30 billion Gb, with SK hynix expected to maintain over 50% market share. Samsung and Micron need to improve yield rates and production capacity to compete in the HBM4 market.
As the demand for AI servers continues to climb, CSPs choose to increase capital expenditure despite facing inflationary pressure following the announcements of tariffs by the US government...
For decades, the semiconductor industry has thrived by adhering to Moore’ Law, achieving rapid development through the continuous miniaturization of transistors...
According to the latest supply chain survey from TrendForce, new US regulations starting in April 2025 will require export licenses for semiconductor chips like NVIDIA H20, AMD MI308...
