According to global market intelligence firm TrendForce, the ongoing progress in the generational evolution of memory products indicates that after DDR3 DRAM was introduced in 2007...
Now, in 2Q25, the DRAM market is still affected by US tariff policies that caused early shipments of consumer electronics, with the quarterly total demand bits showing a QoQ increase...
This week’s Bulletin provides an update on the latest dynamics of server ODMs, CPUs, and GPUs, as well as updates on the supply chain of server cooling...
"As demand for AI servers rises, the adoption of HBM4 memory is set to increase costs, with estimated price premiums exceeding 30%. HBM4 features significant changes, including doubling IO channels to 2048 and using logic chip architecture, leading to higher data transfer rates and reduced latency. However, these advancements also raise manufacturing costs, with wafer costs reaching $7000-8000, making it 3-4 times more expensive than traditional DRAM. In 2026, total HBM shipments are forecasted to exceed 30 billion Gb, with SK hynix expected to maintain over 50% market share. Samsung and Micron need to improve yield rates and production capacity to compete in the HBM4 market.
This week’s Bulletin provides an update on the respective markets of global CSPs and corresponding enterprises OEMs, and renews the annual outlook of server demand...
