TrendForce indicates that NVIDIA will increase shipments of Blackwell GPUs featuring CoWoS-L in 2025, while US trade restrictions may reduce demand for CoWoS-S. NVIDIA's adjusted CoWoS order allocation strategy will shift 60% of demand from CoWoS-S to CoWoS-L, despite tight CoWoS-L capacity. Potential delays in GB Rack shipments and US export controls on AI chips could lead to NVIDIA revising its CoWoS demand downward.
According to the latest research by global market intelligence firm TrendForce, shipments of chips under NVIDIA’s new Blackwell platform, which is set to launch in 2025...
Major CoWoS supplier TSMC continues to expand its capacity alongside the ongoing growth in demand for AI chips, such as GPUs and ASICs of CSPs. TSMC came to a total CoWoS capacity of...
TrendForce forecasts that CoWoS capacity will double in 2025, driven by demand for Blackwell and CSPs' ASICs. TSMC, the major supplier, will expand capacity to meet the demand, with NVIDIA's Blackwell platform accounting for the largest share and CoWoS-L exceeding 50%. AWS's in-house ASIC demand will also significantly increase. While TSMC's capacity expansion may face challenges, overall market demand for CoWoS remains robust.
TrendForce’s observations indicate that NVIDIA is currently the global leader of AI chip supplier, and comprises of almost 90% of the GPU AI server market in 2024...
TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will replace Blackwell Ultra, with shipments expected to commence between Q2 and Q3 2025, primarily targeting performance-focused CSP customers and driving the development of HBM3e 12hi memory. Furthermore, NVIDIA will continue to promote its NVL72 Rack solution, further accelerating the adoption of liquid cooling in AI servers. Improvements in CoWoS-L production capacity and yield rates will also contribute to its wider adoption in AI chips.
According to research by the global market intelligence firm TrendForce, the global AI server market has been experiencing rapid growth over the years...
Despite resilient demand and restricted provision for TSMC’s advanced nodes 5/4nm and 3nm that has led to a price increase of roughly 5-10% for corresponding foundry and advanced CoWoS packaging starting from wafer output since 1Q25...
Global AI chip shipments for 2024 are projected to total nearly 9.4 million units, marking a YoY increase of 61%. The growth is attributed to shipments that were previously deferred in 2023 due to tight supply for CoWoS and...
