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[Selected Topics] NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

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2024-10-03

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Overview

TrendForce forecasts that NVIDIA will focus on promoting its Blackwell B300 series AI chips in 2025, with increased adoption of CoWoS-L packaging and liquid cooling solutions. The B300 series will replace Blackwell Ultra, with shipments expected to commence between Q2 and Q3 2025, primarily targeting performance-focused CSP customers and driving the development of HBM3e 12hi memory. Furthermore, NVIDIA will continue to promote its NVL72 Rack solution, further accelerating the adoption of liquid cooling in AI servers. Improvements in CoWoS-L production capacity and yield rates will also contribute to its wider adoption in AI chips.

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[Selected Topics] NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

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[Selected Topics] NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

Overview

Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

Selected TopicsRelated Reports

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

[Selected Topics] Fueled by AI-Related Applications and CSPs’ Orders, Strong Demand Growth Leads to Upward Revision for Server Market

Download Report

USD $300

Membership

Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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