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Taiwanese foundries face structural shifts: TSMC consolidates 12" mature nodes, UMC hikes 8" prices, VIS pivots to PMICs, and PSMC moves to high-value processes amid supply-demand restructuring.
Backed by massive subsidies, China's equipment makers have made gains in mature nodes and initial inroads into advanced processes, but ecosystem gaps and geopolitics cap long-term growth.
The Diamond reports cover major foundries such as TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc. The Diamond reports provide extended analyses of these foundries' production capacity figures, process node migration and capacity utilization rates. Furthermore, the Diamond reports discuss the competition among foundries and among major regional markets, including Mainland China, Taiwan, South Korea, Japan, etc. The dynamics of competition and cooperation, together with capacity utilization rates of specific nodes, wafer prices, wafer input from major clients at advanced nodes, etc., are all especially highlighted in the Diamond reports
Samsung accelerates the reduction of mature capacities while hiking prices on fully-loaded advanced nodes. Meanwhile, benefiting from supply shifts and early stocking against rising component costs, Chinese foundries maintain high utilization in mature nodes, triggering price hikes for tight capacities. Simultaneously, driven by the localization trend, major Chinese players are actively expanding new fabs.
Driven by strong demand, TSMC accelerates global expansions for advanced nodes and packaging; UMC pushes joint-node sampling despite delays and develops silicon photonics; Vanguard comprehensively raises prices and evaluates overseas expansion; PSMC optimizes profits via memory partnerships, line consolidation, and price hikes.
Driven by robust AI demand, 2026 foundry revenue is set to grow significantly. Advanced nodes and packaging capacities are fully loaded, leading to price hikes. Meanwhile, 8-inch capacity is tightening due to strategic production cuts and rising AI power IC demand. In contrast, 12-inch mature nodes remain weak due to soft consumer electronics market, resulting in a highly polarized industry landscape.
Driven by AI and new smartphone momentum, 2025 global foundry revenue hit record highs, with TSMC extending its market lead via advanced processes. For 2026, despite pre-stocking triggered by anticipated price hikes, AI remains the primary growth engine, while the sustainability of 2H consumer demand warrants close monitoring.
Market outlook diverges: Samsung accelerates US expansion despite yield risks. Rising memory costs slow SMIC and Nexchip, while AI orders boost HuaHong. GlobalFoundries significantly increases capex for localization in US and EU.
The Platinum reports provide analyses of the foundry industry, starting from TrendForce’s memory industry analysis and application demand in the downstream, extending to the semiconductor upstream, encompassing wafer production capacity, process node roadmap, and capacity utilization of each fab. The Platinum reports provide detailed analyses of foundries' competitiveness and capacity utilization rates, specifically focusing on major players including TSMC, UMC, Samsung, SMIC, and GlobalFoundries, etc.. The Platinum reports also discuss the future outlook of the foundry market.
AI fuels HBM/storage price hikes, pushing Memory revenue past Foundry. While weak mature nodes and capacity barriers slow Foundry, Memory's output efficiency and price volatility drive its market dominance through 2026.
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