Two months after its March earnings call, Micron is turning more upbeat on its outlook, while providing additional details on its custom HBM development progress. At the J.P. Morgan 54th Annual Global Technology, Media and Communications Conference, Micron's Global Operations EVP Manish Bhatia, via ...

Huawei is reportedly advancing proprietary packaging technology to boost high-capacity SSD density. According to BLOCKS&FILES, the company has produced 122TB SSDs despite lacking access to the latest 100+ layer 3D NAND from major suppliers. The report notes that, with U.S. restrictions limiti...

With AI demand continuing to rise, China’s domestic foundries are seeing stronger orders and raising prices. According to Securities Times, around 80% of listed companies within the Shenwan semiconductor industry classification reported higher operating costs year over year in 1Q26, with wafer fou...

As Intel's collaboration with SoftBank subsidiary SAIMEMORY on Z-Angle Memory (ZAM) continues to draw intense industry attention, new details are emerging ahead of the VLSI Symposium 2026 scheduled for June. According to a pre-release summary leaked from the VLSI official session listing, Taiwan�...

Corporate registration data from Tianyancha shows that Milphoton Semiconductor (Beijing) Co., Ltd. recently completed a significant shareholder restructuring, adding new investors including Huawei-affiliated Hubble and Suzhou Future Technology Enterprise Service Partnership (Limited Partnership). ...