Recently, the European Commission approved a €1.3 billion subsidy from the Italian government to semiconductor packaging and testing company Silicon Box. The funds will support the construction of an advanced packaging and testing facility in Novara, Piedmont, Italy. Silicon Box's factory will ...

The DRAM winter seems to be around the corner. Following Micron’s clouded outlook, which suggests a roughly 9% quarter-over-quarter revenue decrease, a recent survey conducted by Yonhap News also downgraded the Q4 guidance for South Korean memory giants Samsung and SK hynix. The survey, which g...

Foxconn has announced a partnership with Porotech to enter the AR glasses market, following partnership between the two companies focused on MicroLED microdisplays for AR applications announced in 2023. According to its press release, the collaboration aims to accelerate Foxconn’s strategic advan...

MediaTek has introduced the Dimensity 8400 chip. The Dimensity 8400 is said to deliver powerful Gen-AI performance and brings an all-big-core design to the premium smartphone market for the first time.  According to a report from Economic Daily News, this chip is produced using TSMC's advanced 4nm ...

Broadcom CEO Hock Tan, known as an aggressive dealmaker in the semiconductor industry, told the Financial Times that the company is fully focused on advancing its AI business and has no intention of acquiring Intel. The same report noted that Tan explained Broadcom's AI semiconductor operations a...