Kioxia announced its fiscal 2026 first-quarter results today, reporting revenue of JPY 1.767 trillion, up 76.2% quarter over quarter and 415.5% year over year, exceeding the company's guidance. Profitability also improved significantly, with gross margin reaching 80%, or 82% excluding JV items, whil...

DDR5 MRDIMMs are gaining traction as rising compute demand drives memory makers to accelerate their product roadmaps. According to Wccftech, Renesas has unveiled a new MRDIMM chipset solution capable of enabling DDR5 MRDIMM speeds of up to 16,000 MT/s, up to 25% faster than the previous generation. ...

Ahead of Kioxia's earnings call today, Samsung and SK hynix's 2Q26 results, released earlier this week, both point to NAND Flash's return as a key growth driver. Crucially, ASP gains, rather than shipment growth, are driving the recovery. With major capacity expansion not expected until 2028–29, m...

ASE, the world's largest outsourced semiconductor assembly and test (OSAT) provider, announced at its July 30 earnings call that it has again raised its 2026 capital expenditure. According to Economic Daily News, the company increased its 2026 capital expenditure from US$8.5 billion to US$10.5 billi...

With TSMC's CoWoS (Chip-on-Wafer-on-Substrate) capacity under pressure, the foundry leader is reportedly developing an advanced packaging solution similar to Intel's Embedded Multi-die Interconnect Bridge (EMIB). Citing The Information, TechPowerUp reports that the technology, internally dubbed "EMI...