TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions.
News
According to a report by Economic Daily News, citing Bloomberg, China is reportedly planning an upgraded follow-up to its “Made in China 2025” strategy, aimed at further expanding domestic production of advanced technology products.
As highlighted by Semafor, citing Bloomberg, the new plan is expected to prioritize chip-making equipment and other high-tech sectors.
The new five-year plan is expected to be unveiled at the National People’s Congress in March 2026, although the manufacturing blueprint could be released at any time—either before or after the legislative session, Bloomberg reports.
Officials involved in drafting the plan reportedly aim to preserve the manufacturing sector’s share of gross domestic product (GDP) over the medium to long term, as indicated by Economic Daily News. As the report notes, even as U.S. President Donald Trump pushes to bring manufacturing back to the U.S., Beijing remains focused on steering the development of its manufacturing sector.
The Economic Daily News also highlights that consumer spending accounts for about 40% of China’s GDP, compared with 50–70% in more developed economies—contributing to ongoing trade tensions between China and other nations. Meanwhile, manufacturing investment in China accounts for nearly 40% of GDP—almost double that of the U.S.—and remains high compared to global peers.
China’s Chip Equipment Manufacturers
In recent years, Chinese semiconductor equipment makers have made steady progress in technological innovation. As TechNews reports, companies such as NAURA, AMEC, and ACM Research Shanghai have achieved significant advances in R&D and market expansion, emerging as increasingly competitive players.
TechNews indicates that as of 2024, China’s semiconductor equipment self-sufficiency rate has risen to 13.6%. In the markets for etching, cleaning, photoresist stripping, and CMP equipment, the self-sufficiency rate has surpassed double digits. Meanwhile, although China still lags behind the most advanced international standards in the development of lithography equipment, continuous progress has been made. Notably, SiCarrier claims to have developed lithography machines for 300-mm wafers on 28nm processes and plans to launch an upgraded version compatible with ASML and Applied Materials by 2026, according to anue.
Read more
(Photo credit: AMEC)
