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Foundry Market Bulletin_20230814

2023/08/14

Wafer Foundries

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The on-going reduction on 4Q23 orders among clients for major applications such as smartphones, PCs, and servers, with full adjustments on products ranging from AP to peripheral Wi-Fi and PMIC...

Foundry Market Bulletin_20230731

2023/07/31

Wafer Foundries

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Samsung LSI + Foundry generated roughly US$4.04 billion (calculation based on US$1=KRW$1,315.68) of revenue in 2Q23 under an approximate QoQ increase of 17.3% attributable to...

Foundry Market Bulletin_20230717

2023/07/17

Wafer Foundries

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TSMC generated US$15.66 billion (calculation based on US$1=NT$30.7124) of revenue in 2Q23 under a QoQ reduction of roughly 6.4%, which largely coincided with the upper end of its financial forecast...

Unchanged on “Stifling Advancement and Delaying Maturity” Principle as the Netherlands Announced Export Sanction on Semiconductor Equipment

2023/07/04

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As indicated by the survey of global market intelligence firm TrendForce, the Netherlands had announced its export control on equipment for advanced nodes on June 30th that covers how restricted items...

Foundry Market Bulletin_20230703

2023/07/03

Wafer Foundries

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Samsung’s new fab (Line S6) in Taylor will be segmented into two phases. Phase 1 is planned as a 4nm fab at an approximate capacity of 30Kwspm that is scheduled for official mass production at the end of 2024...

Foundry Market Bulletin_20230619

2023/06/19

Wafer Foundries

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Phase 1 for TSMC’s Japanese fab (JASM) is scheduled for a mass production in December 2024 at a preliminary capacity of about 5Kwspm...

Total Revenue of Top 10 Foundries Fell by Nearly 20% QoQ for 1Q23 Because Demand for End Products Was Weak and Low Season Exacerbated Situation

2023/06/06

Wafer Foundries

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According to global market intelligence firm TrendForce, a combination of several factors negatively affected the demand for electronics and OEMs’ efforts in adjusting their inventories during 1Q23...

Foundry Market Bulletin_20230605

2023/06/05

Wafer Foundries

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Samsung Device Solutions (DS) is divided into four divisions, including Memory, System LSI, Foundry, and Advanced Package (AVP)...

Latest Investigation on Power Outage at STSP on June 1st Finds No Significant Operational Impact on TSMC and UMC

2023/06/02

Wafer Foundries

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According to global market intelligence firm TrendForce, the Southern Taiwan Science Park (STSP) experienced a power outage and voltage drop around 3:00 pm on June 1st...

Latest Investigation on Power Outage at STSP on June 1st Finds No Significant Operational Impact on TSMC and UMC

2023/06/02

Wafer Foundries

 PDF

According to global market intelligence firm TrendForce, the Southern Taiwan Science Park (STSP) experienced a power outage and voltage drop around 3:00 pm on June 1st...

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