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The explosive surge of generative AI (gen AI) has prompted global telecom operators to successively incorporate large language models (LLMs), and develop various services related to gen AI applications, whilst unfolding preliminary verifications on gen AI application scenes. Taiwanese telecom operators are also offering gen AI services as integrated solutions to enterprise users in the hope of improving their overall revenue.
Taiwans’ largest industrial-themed exhibition series, Intelligent Asia 2024, kicked off in late August for a four-day event. Out of the sub-exhibitions, the Taiwan Robotics and Smart Automation Exhibition (TAIROS 2024) garnered a sizeable amount of attention, with booth numbers growing nearly 30% compared to 2023. The event attracted major global robotics manufacturers and key supply chain players looking to capitalize on the growing momentum of industry giants like NVIDIA and Tesla investing in robotics.
TAIROS 2024 showcased advanced factory equipment and robots featuring high-level data analytics and autonomous learning capabilities as its key highlights. The exhibition focused primarily on robotic arms for manufacturing, with AI enhancements delivering benefits such as improved flexibility and optimized processes.
AI is becoming increasingly widespread, driving the rapid global expansion of data centers. This growth has led to an elephant flow in the network traffic of data centers, making Ethernet upgrades and updates a critical necessity for large-scale networking. This report focuses on trends in data center development and network infrastructure, emphasizing analyzing and exploring the optimal adoption of InfiniBand and RoCE (RDMA over Converged Ethernet) solutions.
The global automotive industry is accelerating innovation with a focus on EVs and autonomous driving technology, alongside software-defined vehicles. This vision of safety, efficiency, and sustainability is creating a new blue ocean for automotive sensors
As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:
Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.
Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.
Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.
1. Global Trends in Mobile Base Station Development
2. AI Applications: Mobile Base Stations
3. TRI’s View
Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing transmission performance. This report, aside from probing into the development bottlenecks of existing optical module solutions, also focuses on the dynamics of three major solutions - LPO, OBO, and CPO - and their supply chains.
Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a major challenge. To address this, 3D stacking architecture has emerged as a key technology. TSMC anticipates that within the next several years, a single chip could contain as many as 200 billion transistors. Furthermore, TSMC aims to reach a milestone of over 1 trillion transistors through 3D packaging.
As the AI chip architectures for the integration of memory and logic ICs advance from 2.5D to 3D, breakthroughs in the development of hybrid bonding will be critical. This report examines the implications of these technological advancements, focusing on the growth in the demand for hybrid bonding and related processes as well as how this trend affects equipment providers.
1. Overview of Global Memory Supply
2. Analysis of Mobile Memory Demand
3. Overview of the Smartphone Market
4. TRI’s View
As the overall performance of cloud computing resources becomes more powerful, the energy consumption and heat generated by servers are also on the rise. Data center operators now urgently seek more efficient cooling systems to control this energy consumption. This report primarily analyzes how external objective conditions drive the demand for liquid cooling solutions. Additionally, it examines the development trends of different cooling solutions and the related supply chain in Taiwan.
