Research Reports


Semiconductors


[Selected Topics] From 2.5D to 3D: Key Processes of Hybrid Bonding and Strategies of Equipment Providers

2024/06/05

Semiconductors , Computer System

 PDF

Under the influence of growing AI-related demand and the slowing pace of node migration under Moore’s Law, achieving lower power consumption and higher transistor counts on a single chip has become a major challenge. To address this, 3D stacking architecture has emerged as a key technology. TSMC anticipates that within the next several years, a single chip could contain as many as 200 billion transistors. Furthermore, TSMC aims to reach a milestone of over 1 trillion transistors through 3D packaging.
As the AI chip architectures for the integration of memory and logic ICs advance from 2.5D to 3D, breakthroughs in the development of hybrid bonding will be critical. This report examines the implications of these technological advancements, focusing on the growth in the demand for hybrid bonding and related processes as well as how this trend affects equipment providers.

[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

2024/05/10

Semiconductors

 PDF

TSMC president C.C. Wei was questioned by analysts about the potential introduction of High-NA EUV during TSMC’s 4Q23 earnings call. He responded, “Because of technology itself is no value. Only when that can serve your customer. So we always work with our customers to give them the best transistor technology and the best power-efficient technology and at a reasonable cost, okay? And more importantly, the technology maturity that—in the high-volume production, that's all important. Everything. Everything counted together. So we—every time we know that there are some new structure, new tools such a high-NA EUV, we look at it carefully, look at the maturity of the tools, look at the cost of the tools and look at the schedule of that—how to achieve it. We always make the right decision at the right moment to serve our customers.”

[Selected Topics] Global Trends in Cloud AI Chip Industry (Presentation)

2024/05/08

Semiconductors , Computer System

 PDF

1. Status-quo of the Cloud AI Chip Market
2. Developments of Cloud AI Chipmakers Worldwide
3. Developments of CSPs’ Self-designed AI Chips
4. TRI’s View

[Selected Topics] Analysis on Development Dynamics of Global FPGA Market

2024/05/03

Semiconductors

 PDF

FPGAs have diverse functions and are widely used in various fields, and is increasing in importance with the continuous advancement of electronic devices. This report mainly analyzes the product characteristics of FPGAs, explores their long-term development trends, and also focuses on the development dynamics of the global FPGA market and key suppliers.

[Selected Topics] Dynamic of Taiwan's Cloud AI IC Design Industry (Presentation)

2024/04/19

Semiconductors , Computer System

 PDF

1. Market Status of Cloud AI Chips
2. AI ASIC Suppliers
3. IC Design Service Providers
4. Memory IP Providers
5. TRI’s View

[Selected Topics] Follow-Up and Analysis on Apple’s Supply Chain Shift

2024/04/16

Semiconductors , Telecommunications , Computer System +1

 PDF

As international geopolitical risks rise, Apple is beginning to face the issue of supply chain relocation. Since 2000, Apple has established a complete supply chain layout in China. Before the outbreak of the epidemic, the assembly factory located in Zhengzhou of Henan provided sufficient production capacity for iPhones every year, allowing the products to be exported worldwide. However, the factory's capacity utilization rate continued to decline after the outbreak of the epidemic. In November 2022, a large-scale protest erupted due to some employees' dissatisfaction with wages and epidemic restrictions, leading to serious problems in the supply chain. Apple realized that it could no longer concentrate a large amount of production capacity on a single supplier or region, so it accelerated the relocation of its supply chain.

[Selected Topics] Trends in Global Silicon Photonics Industry

2024/04/12

Semiconductors

 PDF

Silicon photonics, which emerges from the synthesis of silicon-based integrated circuits and semiconductor lasers, plays a pivotal role in advancing semiconductor technologies. This report aims to analyze the development and applications of silicon photonics. It also examines how Taiwan leverages its strengths—such as a robust semiconductor industry, a complete electronics supply chain, and a well-established optoelectronics industry—to seize opportunities in the development of silicon photonics. Furthermore, the analysis includes a review of corporate investments and strategic planning in this emerging field.

[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

2024/04/11

Semiconductors , Telecommunications , Computer System +2

 PDF

Demand for large panel driver ICs is set to rise sequentially throughout 2024, with ample overall supply. However, uncertainty in end-user demand has led to conservative stocking practices in the supply chain, fostering a reliance on short-term, rush orders—a practice that threatens long-term supply chain health.
In 2023, mobile TDDI chips benefited significantly from active repair and second-hand markets, resulting in annual shipments far exceeding intial forecasts. The release of lower-cost capacities by Chinese wafer foundries has helped sustain robust demand for mobile TDDIs through 2023 to 2024. Nonetheless, intense comptition in this segment has escalated price wars.
For AMOLED driver ICs, the introduction of new production capacities has boosted demand as AMOLED smartphone panel penetration increases. Currently, the market faces no-short-term supply shortages. As more suppliers enter the AMOLED DDI market, prices continue to decline. Maintaining profitability in AMOLED DDI production remains a critical challenge for IC manufacturers, especially with stable wafer prices.

[Selected Topics] Recent Developments in the Industry for Automotive Main Control Chips (Presentation)

2024/03/15

Semiconductors , Computer System , Automotive & EV

 PDF

1. Different Types of Automotive Main Control Chips
2. MCU
3. Cockpit SoC
4. Autonomous Driving SoC
5. TRI’s View

[Selected Topics] Rise of Silicon Photonics and CPO Technology Innovating Light Communication Solutions

2024/03/04

Semiconductors , Telecommunications , Computer System

 PDF

As global internet data transmission volume continues to reach new highs, the performance bottleneck of light communication solutions becomes increasingly apparent. This report, on the one hand, explores the shortcomings of existing light communication solutions. On the other hand, it focuses on silicon photonics and CPO technology, analyzing their competitive advantages in the field of light communication, and keeping track of the development dynamics of key manufacturers.

Get in touch with us