Research Reports
2023-04-07
Not
Selected Topics
Selected Topics-0005_An Overview of China’s Semiconductor Industry through the Perspective of Wafer Equipment
Summary
Wafer manufacturing involves the use of various semiconductor equipment that can be categorized into more than ten types, such as photolithography machines, etching equipment, and thin-film deposition equipment (PVD/CVD/ALD). These categories can be further divided based on different working principles or processed materials. The production of these machines involves the integration of diverse scientific techniques, including optics, physics, and chemistry, posing high technical barriers and manufacturing difficulties. These machines are also characterized by their significant worth and high investment in research and development.
Chinese companies engaged in the development of wafer manufacturing equipment mainly include NAURA Tech., Advanced Micro, SMEE, Piotech, Hwatsing Tech., etc. This report primarily discusses the development of China’s semiconductor industry, emphasizing key equipment used in thin-film deposition, etching, and photolithography.
Table of Contents
1. Thin Film Deposition Equipment
2. Etching Equipment
3. Photolithography Equipment
4. TRI's View
<Total Pages:11>
Analysts |
|||
TrendForce |
Today, using smartphones to take photos has become a popular way for people to record and share everyday memories. Camera performance has also become an important factor for consumers when deciding to purchase a new smartphone. However, unlike traditional digital single-lens reflex cameras (DSLRs), smartphones are designed to be lightweight and slim. Therefore, adopting a larger CMOS image sensor (CIS) or a heavier lens assembly to improve photoshoot is not practical. To overcome this physical limitation, advanced image signal processors (ISPs) and innovative computational photography algorithms are used to significantly enhance the imaging quality of smartphone cameras. These solutions can effectively compensate for the shortcoming of not being able to incorporate larger optical components into a smartphone camera.
High-performance computing can handle the workload of automotive electrification, internet of vehicles, ADAS, and autonomous driving technologies, and is capable of adapting to the constantly changing demands of the external environment. This report primarily analyzes the automotive digitalization market, trends in high-performance computing for vehicles, and the key drivers for chip vendors' commercialization solutions in the industry.
In just six short months, AI has advanced from generating text, images, music, and code, to automation and generative agents, exhibiting astonishing capabilities. This report, aside from focusing on the latest developments in AI, also probes into how governments and industries are formulating strategies to ensure positive AI advancements, as well as analyzes the timeline for large-scale implementation of AIGC and its impact on the demand for AI servers.
Research Directory
Semiconductor Research Display Research Optoelectronics Research Green Energy Research ICT Applications ResearchResearch Areas:
Industry News