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[Selected Topics] Analysis on Current Development of Global InP Industry

Last Modified

2023-05-17

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Not

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PDF

Overview

Summary
Components adopted with InP, a compound semiconductor material, are higher in drift velocity for saturation electrons, stronger in radiation resistance, better in thermal conductivity, higher in photoelectric conversion efficiency, and higher in band gap. They are thus more promising in applications of optical communication, data centers, new-gen displays, AI, unmanned driving, and aerospace.

InP materials are primarily used for the production of photonic components and microwave RF components. They are capable of emitting and detecting photons at 1,000m and above wavelengths, as well as high-speed and low-noise high frequency RF applications. This report provides an analysis on the photonic component market that is most concatenated with InP.

Table of Contents
1. Development of InP Industry Guided by Data Communication and Telecom Markets; Consumer Applications Equipped with Potentiality

2. Difficult Processes for InP Substrates and Epitaxy Induced a Highly Concentrated Market

3. High-Speed Optical Chips Dominated by US and Japanese Suppliers; China Accelerates in Development for Optical Modules

4. Analysis on Key Suppliers
(1) AXT
(2) LandMark Optoelectronics
(3) Coherent

5. TRI’s View

＜Total Pages：11＞

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

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[Selected Topics] Analysis on Current Development of Global InP Industry

Overview

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

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[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

[Selected Topics] Fueled by AI-Related Applications and CSPs’ Orders, Strong Demand Growth Leads to Upward Revision for Server Market

Download Report

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Membership

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[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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