Research Reports

Research Reports

[Selected Topics] Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

Last Modified

2023-05-31

Update Frequency

Not

Format

PDF

Overview

Summary
The utilization of chiplets paired with 2.5D and 3D advanced packaging technology is bound to become one of the inevitable development trends of high-end chips in order to allow a continuous elevation of computing performance for chips according to the Moore’s Law. With that being said, the existing micro-bump bonding technology that could impede high-end chips from fully exerting their performance would have to be replaced by hybrid bonding. This report analyzes development trends of chiplet design and advanced packaging technology on the one hand, and probes into the necessity and development momentum of the hybrid bonding technology on future development of high-end chips on the other hand.

Tablet of Contents
1. Continuation of Moore’s Law – Chiplet Designs Paired with Advanced Packaging Technology to Become Mainstream

2. Hybrid Bonding Exhibits Significant Advantages over Bump Bonding Pertaining to Chip Stacking

3. Hybrid Bonding Content Expected to Climb Continuously for High-End CIS and CPU Products

4. TRI’s View
(1) High-End Chips Bound to March Towards Multiple Chiplets and Memory Stacking
(2) Essentiality of Hybrid Bonding Continues to Rise among High-End CIS and CPU

＜Total Pages：12＞

Spotlight Report

PDF

Popular Keywords

USD $200

[Selected Topics] Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

Overview

Spotlight Report

Survey on China’s Automotive Investment_202408

Chinese NEV Brands – Survey on Ecosystem of Cockpits and ADAS Supply Chain_202407

[Selected Topics] Collaborative Robots on the Rise: Taiwan’s Robotics Industry Awaits AI and Humanoid Demand

[Selected Topics] AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

Selected TopicsRelated Reports

[Selected Topics] Rankings of Top 10 Global SSD Module Brands for 2023

[Selected Topics] Capacity and Price Competitions to Intensify in China in 2025 amidst 6% YoY Growth in Global Mature Nodes (Approx. 70% from Chinese Foundries)

[Selected Topics] NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

[Selected Topics] Key to Subversion of Telecom Industry – Development Trends and Commercial Opportunities of Generative AI in Telecom Industry

[Selected Topics] CXMT Exacerbates Competitions in China’s Mobile DRAM Market; DDR4 & LPDDR4X Prices Dragged by Sluggish Consumer Demand

Download Report

USD $200

Membership

Spotlight Report

Survey on China’s Automotive Investment_202408

Chinese NEV Brands – Survey on Ecosystem of Cockpits and ADAS Supply Chain_202407

[Selected Topics] Collaborative Robots on the Rise: Taiwan’s Robotics Industry Awaits AI and Humanoid Demand

[Selected Topics] AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

Research Directory

Semiconductor Research

Display Research

Optoelectronics Research

Green Energy Research

ICT Applications Research

Semiconductors

Display

LED

Energy

Consumer Electronics

Emerging Technologies

Selected Topics

Research Reports

USD $200

[Selected Topics] Hybrid Bonding Technology Portrays Essential Role as Advanced Packaging Continues to Evolve

Overview

Spotlight Report

Survey on China’s Automotive Investment_202408

Chinese NEV Brands – Survey on Ecosystem of Cockpits and ADAS Supply Chain_202407

[Selected Topics] Collaborative Robots on the Rise: Taiwan’s Robotics Industry Awaits AI and Humanoid Demand

[Selected Topics] AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

Selected TopicsRelated Reports

[Selected Topics] Rankings of Top 10 Global SSD Module Brands for 2023

[Selected Topics] Capacity and Price Competitions to Intensify in China in 2025 amidst 6% YoY Growth in Global Mature Nodes (Approx. 70% from Chinese Foundries)

[Selected Topics] NVIDIA’s Blackwell Ultra to Rename to B300; Stronger Adoption for CoWoS-L GPUs Projected in 2025 to Actuate Expansions of HBM3e 12hi and Liquid-Cooling Solutions

[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

[Selected Topics] Key to Subversion of Telecom Industry – Development Trends and Commercial Opportunities of Generative AI in Telecom Industry

[Selected Topics] CXMT Exacerbates Competitions in China’s Mobile DRAM Market; DDR4 & LPDDR4X Prices Dragged by Sluggish Consumer Demand

Download Report

USD $200

Membership

Spotlight Report

Survey on China’s Automotive Investment_202408

Chinese NEV Brands – Survey on Ecosystem of Cockpits and ADAS Supply Chain_202407

[Selected Topics] Collaborative Robots on the Rise: Taiwan’s Robotics Industry Awaits AI and Humanoid Demand

[Selected Topics] AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

Get in touch with us