Popular Keywords
- About Us
-
Research Report
Research Directory
Semiconductors
LED
Consumer Electronics
Emerging Technologies
- Membership
- Price Trends
- Press Center
- News
- Events
- Contact Us
Research Reports
2023-06-09
Not
Selected Topics
Selected Topics-0021_As Diverse Applications Drive Market Growth of HBM, 2.5D Packaging Plays a Critical Role in Development of This Memory Solution
Summary
The load of cloud computing will continue to elevate under the advancement of diversified applications, where restricted growth of performance in DDR SDRAM could encumber the performance of computing systems, which allows HBM to further exert its abilities. This report probes into the demand background and development tendencies of HBM, and focuses on the 2.5D packaging technology that integrates HBM.
Table of Contents
1. Successive Emergence of Four Major Applications Sustains Growth Momentum in Computing Demand
2. HBM Will Be the Best Solution for Building High-Performance Computing Platforms
3. 2.5D Packaging Technology Portrays an Essential Role amidst Expanding Incorporation of HBM
4. TRI’s View
(1) Emergence of Supercomputer, AIGC, 8K, and AR/VR Applications to Drive Establishment of
High-Performance of Computing Platforms
(2) TSMC Possesses Most Competitive Advantages in 2.5D Packaging Technology Yielded by HBM
＜Total Pages：13＞
Analysts |
|||
|
TrendForce |
|||
Today, using smartphones to take photos has become a popular way for people to record and share everyday memories. Camera performance has also become an important factor for consumers when deciding to purchase a new smartphone. However, unlike traditional digital single-lens reflex cameras (DSLRs), smartphones are designed to be lightweight and slim. Therefore, adopting a larger CMOS image sensor (CIS) or a heavier lens assembly to improve photoshoot is not practical. To overcome this physical limitation, advanced image signal processors (ISPs) and innovative computational photography algorithms are used to significantly enhance the imaging quality of smartphone cameras. These solutions can effectively compensate for the shortcoming of not being able to incorporate larger optical components into a smartphone camera.
High-performance computing can handle the workload of automotive electrification, internet of vehicles, ADAS, and autonomous driving technologies, and is capable of adapting to the constantly changing demands of the external environment. This report primarily analyzes the automotive digitalization market, trends in high-performance computing for vehicles, and the key drivers for chip vendors' commercialization solutions in the industry.
In just six short months, AI has advanced from generating text, images, music, and code, to automation and generative agents, exhibiting astonishing capabilities. This report, aside from focusing on the latest developments in AI, also probes into how governments and industries are formulating strategies to ensure positive AI advancements, as well as analyzes the timeline for large-scale implementation of AIGC and its impact on the demand for AI servers.
Research Directory
Semiconductor Research Display Research Optoelectronics Research Green Energy Research ICT Applications ResearchResearch Areas:
Industry News
