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[Selected Topics] Era of Spatial Computing: The Manufacturing Experience and Challenges of Apple’s MR Device(s)

Last Modified

2023-07-21

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PDF

Overview

Summary
At WWDC 2023, Apple announced its first-ever mixed reality product, the Vision Pro, and launched the VisionOS operating system at the same time—marking its entry into the head-mounted display market. The MR headset is groundbreaking in terms of performance and price, signaling the arrival of the era of spatial computing. As Apple ventures into the AR/VR market, the challenges for the supply chain are significant, with numerous obstacles in hardware development still to overcome and costs remaining high. Nonetheless, taking a long-term perspective, this move is expected to continually drive the evolution of AR/VR products and the development of the supply chain.

Table of Contents
1. Era of spatial computing coming as Apple enters the head-mounted display market with Apple Vision Pro
(1) Apple Vision Pro redefines product experience and imagination
(2) Arrival of spatial computing era will change everyday life and work

2. Cost structure and analysis of supply chain distribution
(1) Optical display
(2) 3D sensing system
(3) Computing system
(4) Assembly

3. TRI’s View
(1) Apple Vision Pro to change how people live as era of spatial computing arrives
(2) Vision Pro will drive AR/VR product advancement and supply chain development

＜Total Pages：12＞

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[Selected Topics] Era of Spatial Computing: The Manufacturing Experience and Challenges of Apple’s MR Device(s)

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[Selected Topics] Era of Spatial Computing: The Manufacturing Experience and Challenges of Apple’s MR Device(s)

Overview

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

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[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

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