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[Selected Topics] Foldable Phone Market to Accelerate in Expansion under Maturing Development Conditions

Last Modified

2023-09-26

Update Frequency

Not

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PDF

Overview

Summary
Development conditions for foldable phones are becoming increasingly mature due to the active involvement of smartphone brands. This report probes into the positioning, market segmentation, and hardware specifications of foldable phones, whilst examining their market competitiveness under price changes, future development trends, global market dynamics, and key component suppliers.

Table of Contents
1. Foldable Phones Gain Popularity and Distinction, Enhancing Market Segmentation

2. Foldable Phones Will Face Off with Other High-end Models in the Market as Their Hardware Specifications Become Standardized and Prices Drop
(1) Folding Form: Book-Style and Flip Variations for Mid and High-End Models
(2) Display and Plate: UTG Becomes Standard Configuration as Dimension Approaches Limit
(3) Hinge: U-shaped Hinges Replaced by Teardrop Hinges

3. Foldable Phones to Focus on Slim Designs and Water Resistance in 2024; Shipment to Exceed 25.2 Million Units

4. TRI’s View
(1) Consensus Formed on Three Major Hardware Specifications as Foldable Phones Gradually Find Their
Position in the Market
(2) Shipment of Foldable Phones is Expected to Arrive at 25.2 Million Units in 2024, Benefiting Display and
Hinge Suppliers

＜Total Pages：16＞

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[Selected Topics] Foldable Phone Market to Accelerate in Expansion under Maturing Development Conditions

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

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[Selected Topics] Foldable Phone Market to Accelerate in Expansion under Maturing Development Conditions

Overview

Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

Selected TopicsRelated Reports

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

[Selected Topics] Fueled by AI-Related Applications and CSPs’ Orders, Strong Demand Growth Leads to Upward Revision for Server Market

Download Report

USD $200

Membership

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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