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[Selected Topics] Development of Smart Manufacturing Applications for Edge Computing

Last Modified

2023-12-14

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PDF

Overview

Summary
Edge computing involves the relocation of computing processes from centralized cloud systems to the very source where data are generated. This shift brings about several advantages, notably a significant boost in computing speed and a reinforcement of data security. For the manufacturing sector, where precision, stability, and security are prioritized, edge computing emerges as a pivotal enabler for unlocking the true potential of smart manufacturing. Furthermore, looking towards the future, it is anticipated that the development of edge computing will fully embrace the trend of edge AI.

Table of Contents
1. Background on Development of Edge Computing for Smart Manufacturing
(1) Growing Demand and Technological Advances Expedite Development of Smart Manufacturing
(2) Edge Computing Enhances Overall Efficiency for Smart Manufacturing

2. Trends in Development of Edge Computing and Related Applications
(1) Technologies and Standards
(2) Smart Manufacturing: Applications and Trends

3. Supplier Dynamics
(1) Dell
(2) ADLINK
(3) Neousys

4. TRI’s View
(1) Edge Computing Regarded as Key in Maximizing Benefits for Smart Manufacturing
(2) Development in AI Edge Computing is the Future

＜Total Pages：10＞

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[Selected Topics] Development of Smart Manufacturing Applications for Edge Computing

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[Selected Topics] Capacity and Price Competitions to Intensify in China in 2025 amidst 6% YoY Growth in Global Mature Nodes (Approx. 70% from Chinese Foundries)

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[Selected Topics] Development of Smart Manufacturing Applications for Edge Computing

Overview

Spotlight Report

[Selected Topics] Capacity and Price Competitions to Intensify in China in 2025 amidst 6% YoY Growth in Global Mature Nodes (Approx. 70% from Chinese Foundries)

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Selected TopicsRelated Reports

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[Selected Topics] DRAM Output Projection for 2025 Has Undergone Upward Revisions Due to Weak Demand Outlook, Rising Inventory Levels, and Potential of TSV Capacity Being Shifted away from HBM Production

[Selected Topics] SK hynix Introduces HBM3e 16hi, Boosting Maximum Bit Capacity to 384GB

[Selected Topics] US Is Reportedly Tightening Standards for Reviewing the Use of Advanced AI Chip Manufacturing Technologies by Chinese Chip Customers, Thus Potentially Impacting Sales Performances of TSMC’s Advanced Nodes

[Selected Topics] US Is Reportedly Tightening Standards for Reviewing the Use of Advanced AI Chip Manufacturing Technologies by Chinese Chip Customers, Thus Potentially Impacting Sales Performances of TSMC’s Advanced Nodes

Download Report

USD $200

Membership

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