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[Selected Topics] Analysis and Development Trends on Global Silicon/Semiconductor IP Market

Last Modified

2024-02-22

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PDF

Overview

Summary

The global silicon/semiconductor intellectual property (IP) market scale came to US$6.7 billion in 2023 at a YoY growth of 8.1%, with soft IP core (including firm IP core) and hard IP core respectively accounting for 67.2% and 32.8%. IP core designs, in the hope of fulfilling diversified industrial demand, are expediting in transition to semiconductor solutions that are high in performance, flexibility, and integration. Leading vendors include ARM, M31, Andes Technology, and VeriSilicon.

Table of Contents
1. Current Status of Silicon/Semiconductor IP Market

2. Dynamics and Deployment of Key Vendors
(1) VeriSilicon Launched New IP Solutions Targeting Markets of Data Centers and Automobile
(2) ARM Expands Product Mix and Targets Small AIoT Devices
(3) Andes Technology Focuses on RISC-V and Leans Towards Edge Intelligenc
(4) M31 Targets AI Big Data Storage Market and Enables High-Speed Data Transmission

3. TRI’s View
(1) Silicon/Semiconductor Market to be affected by China and India in 2024
(2) Edge Development Actuated by AI to Complicate Demand for Chip Functions

＜Total Pages：10＞

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[Selected Topics] Analysis and Development Trends on Global Silicon/Semiconductor IP Market

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] Emergence of CubeSats to Open a New Chapter for Global Satellite Market

[Selected Topics] Cloud Computing Shapes the Competitive Landscape of the Robotaxi Industry

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

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[Selected Topics] Analysis and Development Trends on Global Silicon/Semiconductor IP Market

Overview

Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] Emergence of CubeSats to Open a New Chapter for Global Satellite Market

[Selected Topics] Cloud Computing Shapes the Competitive Landscape of the Robotaxi Industry

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

Selected TopicsRelated Reports

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Emergence of CubeSats to Open a New Chapter for Global Satellite Market

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

Download Report

USD $200

Membership

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] Emergence of CubeSats to Open a New Chapter for Global Satellite Market

[Selected Topics] Cloud Computing Shapes the Competitive Landscape of the Robotaxi Industry

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

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