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[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

Last Modified

2024-06-14

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Not

Format

PDF

Overview

Summary
Optical module is an indispensable component for achieving optical communication. However, corresponding issues are becoming increasingly apparent alongside the continuously climbing usage and growing transmission performance. This report, aside from probing into the development bottlenecks of existing optical module solutions, also focuses on the dynamics of three major solutions - LPO, OBO, and CPO - and their supply chains.

Table of Contents
1. Issues Related to Power Consumption and Signal Attenuation Start to Surface as Optical
Modules Constantly Ascend in Usage

2. Successive Debuts of Three Major Solutions as Reduction of Transmission Distance and
Shrinkage of Optoelectronic Components Become Feasible

3. LPO, OBO, CPO Each Equipped with Advantages; Successive Involvement from Supply
Chain

4.TRI’s View
(1) Industry Proposed Three Major Solutions to Tackle Issues of Signal Attenuation and Energy
Consumption among Optical Modules
(2) LPO, OBO, and CPO Equipped with Respective Advantages; CPO Possesses Largest
Potentiality in the Future

＜Total Pages：12＞

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[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

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[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

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[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

Overview

Spotlight Report

[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook

[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

[Selected Topics] The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain

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Spotlight Report

[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook

[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

[Selected Topics] The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain

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