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[Selected Topics] AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

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2024-06-27

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Overview

Summary

As indicated by the survey of global market intelligence firm TrendForce, chip suppliers such as AMD have been actively involved in negotiations with TSMC and OSAT throughout 2Q24 on chip packaging using the FOPLP technology, with major partnership models and items shown below:

Model 1: OSATs transitioning from traditional packaging method to FOPLP when packaging consumer ICs: AMD is currently negotiating with PTI and ASE on PC CPUs, whereas Qualcomm is talking it over with ASE on PMIC. Prior to this wave of demand, MediaTek had been worked with PTI on PMIC, while Qualcomm was already a partner of ASE pertaining to PMIC.

Model 2: foundries and OSATs transitioning from 2.5D wafer level to panel level when packaging AI GPUs: AMD and NVIDIA are currently negotiating with TSMC and SPIL on packaging AI GPUs by switching from the existing 2.5D wafer level to panel level, followed by an expansion in chip packaging sizes.

Model 3: panel providers packaging consumer ICs: NXP and STMicroelectronics are negotiating with Innolux on PMIC products.

＜Total Pages：8＞

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[Selected Topics] AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

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Research Reports

USD $200

[Selected Topics] AMD and NVIDIA Take the Lead in Transitioning to FOPLP for PC CPU, PMIC, and AI GPU to Reduce Cost and Expand Packaging Sizes of Large-Sized Chips

Overview

Spotlight Report

[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook

[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

[Selected Topics] The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain

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