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[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Last Modified

2024-09-04

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Aperiodically

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Overview

(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost reduction could adopt chip-first solution. The segmented market could accommodate different types of suppliers.

(b) development of FOPLP solution by foundry: expanding chip packaging size of 2.5D packaging for AI GPU from wafer level to panel level.

(c) development of FOPLP solution by OSATs: migrating from power IC and RF IC to CPU and GPU, enabling multi-chip packaging.

(d) development of FOPLP solution by panel makers: entry into chip packaging business, supported by licencers.

＜Total Pages：11＞

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[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Overview

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

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[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

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