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[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Last Modified

2024-09-04

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Aperiodically

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PDF

Overview

(a) incentives for chip makers to adopt FOPLP solution: AI GPU makers pursuing chip packaging size expansion could adopt chip-last solution, while power IC and RF IC makers pursuing packaging cost reduction could adopt chip-first solution. The segmented market could accommodate different types of suppliers.

(b) development of FOPLP solution by foundry: expanding chip packaging size of 2.5D packaging for AI GPU from wafer level to panel level.

(c) development of FOPLP solution by OSATs: migrating from power IC and RF IC to CPU and GPU, enabling multi-chip packaging.

(d) development of FOPLP solution by panel makers: entry into chip packaging business, supported by licencers.

＜Total Pages：11＞

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[Selected Topics] FOPLP to Accommodate Different Types of Suppliers with Market Segmentation

Overview

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[Selected Topics] 2024 Analysis of Supply and Demand for Panel Driver ICs

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

[Selected Topics] Mobile Memory and Smartphone Market: 2023 Review and 2024 Outlook

[Selected Topics] A Glimpse into the Adoption Challenges and Technological Planning of TSMC’s 3nm Technology from the TSMC Techonology Synposium

[Selected Topics] The Launch of NVIDIA’s Blackwell and Upgrading of ASICs Will Initiate a Race to Invest in Liquid Cooling across the Supply Chain

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