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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Last Modified

2024-09-25

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Overview

TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM oversupply in 2025. Despite aggressive TSV capacity expansion by DRAM suppliers, the mass production learning curve for HBM3e 12hi is long, and AI chips demand higher stability, creating uncertainty in actual capacity release. TrendForce maintains its forecast of HBM accounting for 10% of total DRAM bit output in 2025 and contributing over 30% of DRAM market value. HBM3e market share will be a key differentiator in DRAM suppliers' profitability.

＜Total Pages：5＞

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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Overview

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[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

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