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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Last Modified

2024-09-25

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Aperiodically

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PDF

Overview

TrendForce indicates that while Samsung, SK Hynix, and Micron have all sampled HBM3e 12hi products, challenges remain in yield ramp-up and qualification, leaving uncertainty over the risk of HBM oversupply in 2025. Despite aggressive TSV capacity expansion by DRAM suppliers, the mass production learning curve for HBM3e 12hi is long, and AI chips demand higher stability, creating uncertainty in actual capacity release. TrendForce maintains its forecast of HBM accounting for 10% of total DRAM bit output in 2025 and contributing over 30% of DRAM market value. HBM3e market share will be a key differentiator in DRAM suppliers' profitability.

＜Total Pages：5＞

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[Selected Topics] Manufacturing of HBM3e 12hi Products Requires Overcoming Learning Curve for Yield Rate and Challenges Related to Qualification; Uncertainty Remains over HBM Supply Surplus Risk in 2025

Overview

Spotlight Report

Survey on China’s Automotive Investment_202408

Chinese NEV Brands – Survey on Ecosystem of Cockpits and ADAS Supply Chain_202407

[Selected Topics] Collaborative Robots on the Rise: Taiwan’s Robotics Industry Awaits AI and Humanoid Demand

[Selected Topics] AI Accelerates Strategic Integration of Data Centers, Making RoCE a Key Player

[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

[Selected Topics] AI Applications: 5G Base Stations

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[Selected Topics] Rankings of Top 10 Global SSD Module Brands for 2023

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[Selected Topics] LPO, OBO, and CPO Put to Test as Optical Modules Encounter Bottlenecks

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