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[Selected Topics] A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

Last Modified

2024-10-30

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Overview

Summary
The report provides an in-depth exploration of the applications and growing demand for ABF substrates in AI servers, autonomous vehicles, and high-performance computing (HPC). Furthermore, it provides an analysis of the activities and future development trends of major Taiwanese manufacturers, with a focus on strong, sustained market growth beyond 2025.

Table of Contents
1. ABF Substrate Market: Current Status
(1) AI-powered advancements propel high-end IC packaging
(2) ABF substrates driven by demand for HPC

2. AI Driven Growth Across Sectors: ABF Substrates as Catalysts for Innovation
(1) AI-powered PCs poised to drive recovery of ABF demand
(2) AI drives surging server demand and fuels rapid growth in ABF substrates
(3) New opportunities for substrates driven by AI and high-frequency network deployment
(4) Electrification and autonomous driving fuel growth for ABF demand

3.Updates on Taiwanese Manufacturers
(1) Unimicron
(2) Nan Ya PCB
(3) Kinsus

4.TRI’s View
(1) Surging demand for ABF substrates highlights need for supply chain resilience
(2) Substrate industry faces short-term pressures and expands capacity to meet AI demand
(3) Outlook for the ABF substrate market in 2025: Growth driven by AI servers and automotive
applications

＜Total Pages：12＞

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[Selected Topics] A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

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[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

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[Selected Topics] A New Era of IC Packaging: The Crucial Role and Market Outlook of ABF

Overview

Spotlight Report

[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

Selected TopicsRelated Reports

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] CoWoS Production Capacity Will Continuously Adjust to Meet Actual Demand, and CSPs Keep Providing Strong Momentum for Orders Related to NVIDIA’s GPUs and In-House ASICs

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] NVIDIA Plans to Launch GB300 in 2Q25; GB300 Racks to Ramp Up in 4Q25 as Supply Chain Requires Extra Time on Testing and Qualifications for Higher Specifications

[Selected Topics] Mobile DRAM May See Early Rebound in Contract Prices as Growing Demand of LPDDR5X Ascends Market Sentiment

[Selected Topics] Fueled by AI-Related Applications and CSPs’ Orders, Strong Demand Growth Leads to Upward Revision for Server Market

Download Report

USD $200

Membership

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[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan

[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network

[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications

[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance

[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware

[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream

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