Research Reports
[Selected Topics] SK hynix Introduces HBM3e 16hi, Boosting Maximum Bit Capacity to 384GB
Last Modified
2024-11-11
Update Frequency
Aperiodically
Format
Overview
TrendForce indicates that SK hynix has launched the industry's first HBM3e 16hi product, boosting maximum bit capacity to 384GB. This move aims to address the demand for higher-capacity HBM. Compared to HBM4, HBM3e 16hi offers lower I/O and smaller die size, facilitating easier mass production. Leveraging its MR-MUF process advantage, SK hynix's early release of the 16hi product strengthens its leading position in the HBM market and allows it to accumulate valuable experience in 16hi mass production, accelerating the development of HBM4 16hi.
<Total Pages:4>
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF
Selected TopicsRelated Reports
Download Report
USD $299
Membership
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF