Research Reports
[Selected Topics] Global Top 10 Foundries’ Total Revenue Reached a Record High of Over US$34bn in 3Q24 as Advanced Nodes Maintain Strong Growth and China Provides Policy Stimulus
Last Modified
2024-12-02
Update Frequency
Aperiodically
Format
Overview
TrendForce reports that global top 10 foundries achieved record-high revenue of US$34.9 billion in 3Q24, a 9.1% QoQ growth, driven by strong advanced node demand and policy stimulus in China. TSMC's market share reached around 65%, fueled by 3nm mass production. While advanced nodes are expected to remain strong in Q4, mature node demand will likely weaken. However, policy stimulus and year-end stocking in China will partially offset the decline.
<Total Pages:8>
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF
Selected TopicsRelated Reports
Download Report
USD $299
Membership
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF