Research Reports
[Selected Topics] IDMs Seize “China for China” Opportunities through Proactive Collaboration with Chinese Foundries in Development of Manufacturing Processes
Last Modified
2024-12-13
Update Frequency
Aperiodically
Format
Overview
TrendForce indicates that heightened geopolitical tensions are driving IDMs to seize "China for China" opportunities through collaborations with Chinese foundries. Driven by localization and cost-cutting demands in China's automotive market, European and Japanese IDMs like STMicroelectronics, Infineon, NXP, and Renesas are actively partnering with Chinese foundries such as SMIC and HHGrace to develop automotive MCUs and other products. This collaboration will help Chinese foundries enhance their technology platforms and achieve a more autonomous supply chain. These partnerships are expected to contribute to wafer output and revenue starting in 2H25 at the earliest.
<Total Pages:7>
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF
Selected TopicsRelated Reports
Download Report
USD $299
Membership
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF