Research Reports
[Selected Topics] DeepSeek Optimizes AI Deployment Costs and Creates New Sources of Memory Demand
Last Modified
2025-02-17
Update Frequency
Aperiodically
Format
Overview
TrendForce analyzes that DeepSeek reduces AI deployment costs through optimized algorithms, creating new opportunities for SMEs. While the short-term impact on the memory market is limited, in the long term, DeepSeek will drive the popularization of edge AI applications, increasing DRAM capacity in PCs and smartphones, and boosting demand for high-performance NAND Flash like UFS 4.0. Concurrently, DeepSeek may reduce demand for high-end GPUs and HBM, but will increase demand for general-purpose server DRAM and enterprise SSDs.
<Total Pages:7>
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF
Selected TopicsRelated Reports
Download Report
USD $199
Membership
Spotlight Report
-
[Selected Topics] Updates and Impacts Related to Effects of Trump Administration’s Tariffs on Canada, Mexico, China, and Taiwan
2025/02/20
Selected Topics
PDF
-
[Selected Topics] NVIDIA Announced Next-Gen B300, Rubin, and Vera at GTC 2025; Shift from GB NVL72 to VR NVL144 and Rubin Ultra NVL576 to Advance Memory, Liquid-Cooling, and CPO Communication Network
2025/03/19
Selected Topics
PDF
-
[Selected Topics] The Rise of DeepSeek and Trends in Agentic AI Applications
2025/02/12
Selected Topics
PDF
-
[Selected Topics] Samsung Expedites Adoption of Hybrid Bonding through YMTC’s Patent Authorization as AI Demands Better Transmission Performance
2025/03/13
Selected Topics
PDF
-
[Selected Topics] Analysis of the Impact of U.S. Ban on Chinese Automotive Software and Hardware
2025/01/24
Selected Topics
PDF
-
[Selected Topics] AI Chips to Extricate Smartphone Market from Negative Growth and Gradually Become Market Mainstream
2025/01/08
Selected Topics
PDF