TrendForce reports that this move has accelerated a shift in supply chains, resulting in increased orders for Taiwanese foundries, which are now seeing higher-than-expected capacity utilization rates. In the second half of this year, Vanguard's capacity utilization rate is expected to rise above 75%, PSMC's 12-inch capacity utilization rate will reach between 85 to 90%, and UMC's overall capacity utilization rates are projected to reach 70–75%.
In the wake of a 7.2-magnitude earthquake off the eastern coast of Taiwan at 7:58 AM on April 3rd, TrendForce immediately investigated the damage and operational status of various manufacturers. The DRAM industry, primarily located in the northern and central parts of Taiwan, and the foundry industry, spread across the north, central, and southern regions of Taiwan, appear to have sustained minimal initial damage.
TrendForce’s latest report reveals that in 2023, global foundry revenues hit US$117.47 billion, with TSMC capturing a dominant 60% share. This figure is expected to climb to around $131.65 billion in 2024, increasing TSMC’s share to 62%.
Intel and UMC officially announced their landmark collaboration on January 25, 2024, geared toward developing the 12-nanometer process. TrendForce believes that this partnership, which leverages UMC’s diversified technological services and Intel’s existing factory facilities for joint operation, not only aids Intel in transitioning from an IDM to a foundry business model but also brings a wealth of operational experience and enhances manufacturing flexibility.
TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area. This includes MLCC manufacturer TAIYO YUDEN, silicon wafer (raw wafer) producers Shin-Etsu and GlobalWafers, and fabs such as Toshiba and TPSCo (a joint venture between Tower and Nuvoton).
TrendForce’s latest findings reveal that as of 2023, Taiwan holds approximately 46% of global semiconductor foundry capacity, followed by China (26%), South Korea (12%), the US (6%), and Japan (2%). However, due to government incentives and subsidies promoting local production in countries like China and the US, the semiconductor production capacities of Taiwan and South Korea are projected to decrease to 41% and 10%, respectively, by 2027.
TrendForce reports that from 2023 to 2027, the global ratio of mature (>28nm) to advanced (<16nm) processes is projected to hover around 7:3. Propelled by policies and incentives promoting local production and domestic IC development, China’s mature process capacity is anticipated to grow from 29% this year to 33% by 2027. Leading the charge are giants like SMIC, HuaHong Group, and Nexchip, while Taiwan’s share is estimated to consolidate from 49% down to 42%.
TrendForce research indicates that in 1H23, the utilization rate of 8-inch production capacity primarily benefited from sporadic inventory restocking orders for Driver ICs in the second quarter.
TrendForce reports an interesting shift in the electronics landscape: dwindling inventories for TV components, along with a surging mobile repair market that’s been driving TDDI demand, have sparked a smattering of urgent orders in the Q2 supply chain.
