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keyword:Avril Wu138 result(s)

Press Releases
TrendForce: 1H'Nov Prices Stay Flat, Weak Market Demand Increases Pressures for Price Adjustments

2013/11/21

Semiconductors

According to DRAMeXchange, a research division of TrendForce, the upcoming off peak quarter and underwhelming worldwide demand have made manufacturers relatively unwilling to agree on the 1H'Nov contract prices Due to the persistence of such a situation, along with SK Hynix's strategic decision to lock its Q4 prices, the contract prices have remained mostly flat The 4GB average prices stayed relatively unchanged at US $32, whereas the 2GB prices remained at US$1775 Looking at the market, even though SK Hynix is still in the process of recovering, its wafer production levels have reached 30K during October In November, that number is expected to rise up to 40K-60K The full recovery of the Wuxi plant is currently projected to take place in 1Q14, despite the apparent shipment delays for various necessary equipments In an effort to ease the market shortages resulting from the fire accident, SK Hynix has immediately activated the DRAM productions at the M10 and M12 plants in Korea, which enabled output to gradually increase in November The gradual easing of the supply is already becoming evident in the spot market: the 2Gb prices have dropped from a high of US$ 218 in early November down to approximately US$ 198, a 92% decrease The 4Gb prices, on the other hand, officially decreased by 34% to below US$ 4 Judging from the disruptions to the price uptrend that followed SK Hynix's fire accident and the underwhelming demand in the market, the Q4 contract prices are likely to either remain steady or experience a slight decline Strategy of Three Largest DRAM Manufacturers Becomes Clear under Oligopoly Market Structure, 2014 Market Momentum Likely to Receive Boost Following the DRAM market's transformation into an oligopoly, the three major DRAM manufacturers' 2014 strategies have become increasingly more transparent This is not only expected to influence the future development of the DRAM market in 2014, but also affect the growth of the market's largest DRAM manufacturing companies Samsung, as an example, has decided to increase production at the Line 12 and 16 plants as a means to compensate for the potential wafer losses resulting from the 25nm manufacturing process rather than to simply expand capacity While the Korean company's DRAM wafer output is expected to be the same in 2014 as it was during 2013, the main focuses of its product mix will likely shift towards Mobile DRAM and Server DRAM With regard to SK Hynix, given that its Wuxi plant has been gradually making a recovery following the fire accident, as many as 30K wafers have been produced by the company during October With its Korean plants also increasing total DRAM production, it should not be a problem for the company’s wafer production output to reach pre-fire accident levels by the end of the year As the Wuxi plant undergoes a possible full recovery in 1Q14, the production at SK Hynix's Korean plants is expected to gradually decrease, and SK Hynix will begin to focus on advancing the manufacturing processes for its Mobile DRAM and PC DRAM product lines Following Micron's and Elpida's official announcement of their merger in 8/1, the two companies --now collectively known as the new Micron group-- will begin to develop and migrate towards the 20nm manufacturing process The actual trial productions involving the said technology will likely be delayed to 1Q14, given the potential difficulties involved in the migration process Nevertheless, the new Micron group’s major product development plans will remain largely unchanged, and, like Samsung, the major products of its future product mix are set to be Mobile DRAM and Server DRAM Looking towards 2014, it appears the focuses of the main DRAM manufacturers will mostly be on adjusting product type and manufacturing technologies In the event that the manufacturers' capacities are not expanded any further, the 2014 growth rate is likely to be only 28%, which is far lower than the 50% and above growth observed in the past (DRAM growth has been below 30% in the past three years) As the three biggest DRAM manufacturers begin to focus on profits more than market share, the market has a legitimate chance of returning to a steady state

Press Releases
TrendForce: Mobile DRAM to Become Mainstream in 2014, Global Revenue Increases by 14 % in 3Q13

2013/11/19

Semiconductors

According to DRAMeXchange, a research division of TrendForce, the mobile DRAM price reductions have eased due to the increased number of Q3 smartphone shipments and SK Hynix's Wuxi plant fire accident Looking at the market, the Q3 mobile DRAM revenues have jumped by an estimated 14% QoQ to US$ 33 billion, representing more than 30% of the entire market's DRAM revenue The revenue number has a chance of increasing further should future shipments continue to rise Observing the mobile DRAM companies' rankings, TrendForce's assistant vice president Avril Wu notes that the two main Korean manufacturers' market shares are continuing to grow and currently add up to a total of 763% Given that Samsung's market share alone is already more than 50%, both its pricing and product strategies are expected to affect the future productions of mobile DRAM considerably In the periods ahead, further impacts on the mobile DRAM industry are likely to arise from the changes experienced by Micron's supply chain following its official merger with Elpida With the potential changes affecting the structure of market demand, the shipment of mobile DRAM is likely to officially surpass that of PC DRAM in 2014 Samsung to Use Third Party Components for Smartphones, SK Hynix to be the Greatest Beneficiary Samsung's mobile DRAM market share has improved from 503 % in 2Q13 to 513% in the following quarter Given that the Korean company's Galaxy devices are expected to use mobile DRAM components from both SK Hynix and Micron, TrendForce projects that Samsung's future market share will end up being around 40%~50% With its emphasis shifting from market share to profits, Samsung will likely place an increased amount of focus on improving the time-to-market (TTM) for its next generation LPDDR3 and 6Gb mono products SK Hynix's mobile DRAM market share appears to be largely unchanged from the previous quarter, decreasing slightly from 257% to 25% Its mobile DRAM revenue, on the other hand, showed an increase of approximately 108% QoQ In China, the growth of SK Hynix's smartphone market share appears to be persisting thanks to the reservations various branded manufacturers hold towards Samsung’s components Looking at the future, both SK Hynix and Samsung have equally impressive plans for their mobile DRAM products: both are in the process of migrating towards the 25nm manufacturing process, and both have already delivered samples of LPDDR3 6 Gb to their clients The distance between the two companies will likely grow smaller as Samsung begins to look elsewhere for its mobile components New Micron Group Shows Potential despite Shrinking Market Share The new Micron group's mobile DRAM market share – combined for the first time for the purpose of assessing the Q3 revenue rankings — has reached 221% in 3Q13, while its Q3 revenues grew by 107% QoQ The increase in its revenues is mainly due to the growing demand for Apple products during the peak quarter, which prompted Rexchip, Elpida’s subsidiary branch in Taiwan, to take steps to raise its entire mobile DRAM production Other than smartphones and tablets, products such as Apple's MacBook Air (which uses LPDDR3) and higher DRAM capacity per unit are also likely to strengthen Micron's future development In the periods ahead, it is believed that the merger between Micron and Elpida will help enable the two companies’ mobile DRAM product line to be more complete The MCP and eMCP products, in particular, are likely to provide a noticeable boost to the new Micron group’s 2014 revenues Taiwanese DRAM Manufacturers to Direct Attention towards Large Density Mobile DRAM and China Market, Partner with Module Manufacturers on eMCP Winbond's mobile DRAM revenue has decreased by approximately 20% compared to the previous quarter, giving it a global market share of 07% and a mobile DRAM revenue share of 13% Due to the changes taking place in the entire global smartphone market and the lowered shipments of feature phones, the shipment performances of small density DRAM have become increasingly weaker Other than developing various mid to low density mobile DRAM for 4G/LTE Basebands, Winbond has begun to shift much of its attention towards the larger density LPDDR1 and LPDDR2 products, and is currently getting ready for the mass production phase In the future, the Taiwanese company is likely to begin taking advantage of the foundry services provided by Powerchip, which uses a more advanced manufacturing process This will help the company lower its overall manufacturing cost Looking at Nanya, given that its mobile DRAM has officially entered mass production, its Q3 revenues were able to jump by nearly 200% QoQ Its market share, meanwhile, rose from 03% in 2Q13 to 09% in the following quarter At the moment, LPDDR2 4Gb is among the notable products that are ready to be mass produced (the mass production of the other major product line, LPDDR3 4Gb, is likely to follow soon after) With Nanya's mainstream manufacturing process involving 30nm technology, the company has a legitimate shot of competing effectively against a number of first tier manufacturers Nanya's current plans are to focus on promoting its mobile DRAM products in China and to work with first tier module manufacturing plants on making eMCP products

Press Releases
TrendForce: 3Q13 Global DRAM Revenue Rises by 9%, Samsung Shows Most Noticeable Growth

2013/11/12

Semiconductors

According to DRAMeXchange, a research division of TrendForce, the Q3 worldwide DRAM revenues showed a 9% QoQ increase despite the price growth in 3Q13 being slower than that of 1H13 The Q3 revenue growth is mostly attributable to the improvements in the structure of the DRAM industry, and is likely to enable various DRAM vendors to sustain their profitability On average, all three of the biggest DRAM manufacturers were able to enjoy an estimated 2% QoQ increase in their operating margins, with the output of PC DRAM being a key differentiating factor TrendForce’s assistant vice president, Avril Wu, indicates that SK Hynix was able to enjoy an operating income growth of approximately 34% --beating Samsung for the second straight quarter-- thanks to the relatively larger output proportion of PC DRAM While the 2H13 DRAM prices were originally expected to drop amid weak market demand, the fire accident experienced by SK Hynix’s Wuxi plant in September helped turned things around by allowing the ASP uptrend to continue In 2013, the total worldwide DRAM revenue is likely to experience an estimated growth of 40% compared to the previous year, with the three major DRAM manufacturers in the industry likely to enjoy the most significant profit momentum Looking at the branded DRAM manufacturer ranking for Q3, Samsung and SK Hynix each account for approximately 37% and 29% of the market, respectively A part of the reason for the increased difference between the two manufacturers’ revenue shares is that Samsung has raised the proportion of its PC DRAM as a means to reclaim territory in the market and to improve its profitability In the long run, the Korean company’s capacity adjustments are likely to become increasingly more flexible as it seeks out other potential vendors to supply mobile DRAM components for its smartphones and increases the DRAM capacity in its Line 16 plant The added DRAM production is expected to be approximately 30K per month by the end of this year, and is likely to be enough to make up for the yield losses resulting from the company’s 25nm process migrations In the future, even if mobile DRAM components continue to account for the largest proportion of its product mix, Samsung’s PC DRAM output is still likely to expand from 20% to around 25% A noticeable impact on the future pricing movements can be expected should such an expansion occur With regard to SK Hynix, given that the Q3 PC DRAM price increase is lower than that of previous quarter, its revenue growth in 3Q13 ended up being only 37% (compared to the 407% growth from 2Q13) Regardless, the Korean company still managed to maintain respectable profit momentum, and saw a 34% increase in its operating margins, the highest among the DRAM manufacturers Looking ahead to 4Q13, with SK Hynix’s PC DRAM output shrinking from 35% to 25% following the Wuxi plant fire accident, it is predicted that Samsung will eventually be able to reclaim its profit lead The recovery period of the Wuxi plant, which remains unclear at the moment, will likely play a crucial role in determining 2014’s pricing momentum When added together, Micron’s and Elpida’s revenue represents approximately 262% of the market, and is only 2% less than that of SK Hynix The new Micron group’s monthly output level has become the second largest in the industry following the markets transformation into an oligopoly in 3Q13 With the new company group’s 30nm manufacturing process still relatively behind those of its major competitors and Elpida’s average selling price being somewhere below the industry standard, the entire company’s ability to profit in the short term is slightly impacted However, given that it is planning to gradually migrate to the 25/20nm manufacturing process and is looking to get each of its plants to maximize efficiency by focusing on specific products, Micron's ability to generate respectable profit in the future should not be underestimated When looked at from the perspective of the PC DRAM market, the new Micron group’s total output already represents one third of the entire industry Such a status undoubtedly provides a major boost to the company's influence in the market Looking at the Taiwanese manufacturers, considering the fact that Nanya has stopped obtaining wafers from Inotera since 3Q13, that its output has undergone a notable reduction following the migration to the 30nm process, and that its PC DRAM production proportion has been lowered, the company was not able to experience much benefit from the market effects of SK Hynix's Wuxi Plant fire accident Nanya’s revenue, by the end of 3Q13, declined by an estimated 83% Powerchip’s revenues, by contrast, jumped by nearly 75% as the company chose to re-establish its P3 plant’s foundry services in May The Taiwanese company, additionally, also benefitted from the rise in the price of its foundry services and the increase in orders for the more profitable products Affected by the gradually lowered featurephone shipments of its clients, Winbond’s business for small density mobile DRAM took a hit, and its revenues slid by approximately 52% QoQ Following the impact of SK Hynix’s Wuxi plant fire accident on specialty DRAM, there is a possible chance that the Taiwanese company’s revenue will rebound during 4Q13 Observing the entire market, TrendForce believes that the Wuxi plant fire accident will continue to have a major impact on the Q4 momentum and development prospects of the three major DRAM manufacturers in the industry Samsung is already taking steps to ramp up the proportion of its PC DRAM wafers, for example, while SK Hynix is looking to get its Wuxi plant to fully recover Micron, in the meantime, has been increasing its efforts to develop its 20nm manufacturing process Even with the DRAM market becoming an oligopoly and price stability and profits becoming the major focuses within the industry, there’s little question that the competition among the above three manufacturers will continue in the periods ahead  

Press Releases
TrendForce: 1H’October Contract Prices Continue to Rise due to Effects of SK Hynix’s Fire Accident, 4GB Module Prices Approach $US 35

2013/10/21

Semiconductors

According to DRAMeXchange, a research division of TrendForce, the highest price for the mainstream 4GB modules has reached $US 34 due to the supply shortages resulting from SK Hynix’s fire accident and the continuous contract price uptrend The price represents an estimated 625% increase compared to the amount observed in September Calculating on the basis of the aforementioned figure, the 4Gb chip price translates to approximately $US 394, which is close to the $US 4 mark, and only 8% lower than the highest 4Gb chip price in the spot market ($US 425) By the time the contract prices are announced in 2H’October, it is expected that the difference between the contract price and spot price will grow smaller The overall impact that SK Hynix’s Wuxi plant fire has on first tier PC-OEMs do not appear to be overly significant In part, this is because the Korean company generally prioritizes providing the majority of its supplies to these OEMs The second and third tier PC OEMs, on the other hand, are gradually feeling the impacts of the supply shortages With such a trend continuing, the spot prices are unlikely to drop anytime soon Even though SK Hynix is currently intensifying its efforts to recover lost production and is looking to resume wafer start in November, the main production supplies intended for the market will not be ready until either December or the beginning of 2014 The Q4 pricing movements, for the most part, are still expected to be influenced by the supply shortages in October and November Samsung Seeking to Reclaim PC DRAM Market following SK Hynix’s Fire Accident The fire incident at SK Hynix’s Wuxi plant has caused the production of nearly 130K wafers to be halted on a monthly basis, which in turn led to a 40% increase in spot prices and the monthly growth in the contract pricing market The contract prices have already managed reach close to the $US 35 mark as of 1H’October Under the aforementioned developments, two Korean manufacturers are taking action to protect their status within the PC DRAM market Samsung has begun to make necessary adjustments to enhance its PC DRAM market share by increasing the PC DRAM production in its Line 12 and Line 16 plants In attempting to compensate for lost production following the fire accident, SK Hynix increased the utilization rate in both its M10 and M12 plants, and has made an effort to allocate parts of its NAND Flash capacity to DRAM According to TrendForce’s estimates, the combined total of the two aforementioned companies’ added production is between 100K-120K per month, which is about equivalent to the original capacity at the Wuxi plant By the end of Q4, both Samsung’s and SK Hynix’s added wafer output levels are likely to reach a maximum, with the main production set to begin in 1Q14 and expected to make up for the losses from the fire With regard to the new Micron group, given that its production is relatively unaffected by the fire accident, its Singapore Tech plant will continue to allocate DRAM capacity to NAND Flash, whereas its Hiroshima plant will ramp up the production of mobile DRAM in order to satisfy the demands of its major clients While the level of DRAM production has increased in Micron’s Taiwan group (Rexchip), this strategy has reportedly been implemented before the fire accident, and no changes have apparently been made TrendForce believes that even if the relevant DRAM production is increased, the impact will only be noticeable during the end of Q4 and the beginning of 2014 In the near term, neither the production shortage situation nor the price uptrend is expected to change anytime soon

Press Releases
TrendForce: SK Hynix’s Two-Month Lack of Output to Amount to 260K Capacity Decrease, Micron to See Second Largest Market Share in Q4

2013/10/03

Semiconductors

According to DRAMeXchange, a division of global market research firm TrendForce, SK Hynix’s Wuxi fab is based on Gemini architecture Part of the fab was originally an 8-inch wafer fab with a smaller capacity, and this is where the fire originated The damages have affected around 100K wafers per month of the plant’s 130K wafers per month capacity The remaining 30K wafers per month suffered smoke damage, and capacity has not been restored as of today It is likely the Wuxi plant will not have any output in September and October To avoid losing clients, SK Hynix has been urgently increasing capacity at its M10 fab as well as using NAND capacity at the M12 plant for DRAM production, in hopes of minimizing the impact of the fire TrendForce assistant vice president, Avril Wu indicates SK Hynix was neck and neck with Micron in terms of second quarter DRAM revenue, the suppliers selling US$256 billion and US$24 billion, respectively As the Wuxi plant produced nearly half of SK Hynix’s total DRAM output, even if the supplier has inventory stocked up, a revenue drop is unavoidable TrendForce expects SK Hynix will see the greatest revenue impact in the fourth quarter, at which time Micron will have a chance to surpass the Korean manufacturer and take second place in the revenue rankings Looking at technology, the new Micron group will finish developing the 20nm process in the fourth quarter It is also rumored that the US supplier intends to expand capacity significantly next year in Rexchip – Micron’s ambition will certainly give Samsung a run for DRAM no1 position in the days to come  

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