News

Apple’s Newest Display to Boost High-End Demand, with Mini LED Backlights to Become Both a Chance and a Challenge


2019-06-17 Optical Semiconductors editor

LEDinside, a division of TrendForce, points out that Apple has just released the Pro Display XDR 32-inch 6K display, which utilizes a brand new LED backlight solution. In doing so, Apple is motivating the display industry to actively explore new solutions for high end products, with next generation Mini LED backlight technology to become the main area of development for many suppliers. Mini LED backlight revenue is expected to reach US$340 million in 2023 (not including the revenue from other driver ICs and backplanes).

TrendForce points out that the brand new LED backlight solution includes a bright array of 576 blue LEDs and a passive-matrix driver IC that can control each LED with swift precision. This allows Apple's Pro Display XDR 32-inch 6K display to achieve 1,000 nit brightness and can even reach a peak brightness of 1,600 nit, with a contrast ratio of up to 1,000,000 : 1. Although this backlight solution isn't the Mini LED backlight widely rumored in the industry, it does shine a ray of light for LED and display manufacturers.


(Image: Apple)

Displays utilizing Mini LED backlights are equipped with local dimming, which gives a contrast effect similar to that of OLED displays. Mini LED backlight displays even cost less than OLED displays. For panel manufacturers, this will allow product specifications to go that extra mile and get a chance to compete with OLED technology. Although current high-end displays still lack backlight technology on par with true Mini LED backlights, we can already see high-end TVs, whether produced by Samsung or Sony, using multiple traditional backlight LEDs with the help of local dimming methods to give a display performance of higher contrast and quality.

Mini LED Backlight Products Remain Expensive, with Suppliers Aiming to Commercialize in 2 to 3 years

Currently, costs still form the main challenge faced by Mini LED backlight products. Factors such as the increasing number of LED chips and driver ICs, yield and uniformity caused costs to remain high. Furthermore, despite the speedy downfall of current LCD panels prices, the additional Mini LED backlight costs will offset this fall and even increase overall display costs, seriously impacting customers' desire to introduce Mini LEDs.

TrendForce asserts that Mini LEDs can be viewed as both a chance and a challenge. Many panel suppliers are actively seeking to develop glass backplanes with active driving solutions in an attempt to lower the costs of LED driver ICs and PCBs. Equipment manufacturers are also developing new methods of mass transfer to lower component manufacturing costs for Mini LED. Suppliers hope to lower costs down to a degree viable for commercialized mass production.

This year, LEDinside's annual Micro LEDforum event presents “Micro LED: Key Technology and Application Market,” and will be held at the NTUH International Convention Center on July 2, 2019. Industrial leaders from around the world have been invited to the event; side by side with LEDinside's professional team of analysts, they will give a comprehensive analysis on key market trends, ranging from manufacturing equipment, chip design, testing solutions, transfer techniques, driver design, display and niche technological products. We eagerly look forward to seeing everyone take part in this grand occasion, and we definitely hope to see you there!

Event link: https://seminar.trendforce.com/LEDforum/2019/US/INDEX/


 

 

2019 Mini LED and HDR High-End Display Market Report
Release Date: 30 April 2019
Format: PDF
Language: Traditional Chinese / English
Page: 100~112
Quarterly Update: Micro / Mini LED Market Prospective Analysis-Player Movement, New Technology Introduction, and Display Week / Touch Taiwan Exhibit Show Report (April, July, October 2019; 10-15 Pages / Quarterly)

Chapter 1 Mini LED Market Scale Analysis
 2018-2023 Mini LED Output Value Analysis and Forecast
 2018-2023 Mini LED Output Analysis and Forecast
 2018-2023 Mini LED Backlight Display Penetration Rate Forecast
Chapter 2 Mini LED Definition and Application Advantages
 Display Development Trend
 The Origin of Miniaturized LED
 Miniaturized LED Size Definition
 LED Light Source for Display
 Mini LED Backlight Product Highlights
 Mini LED Backlight Product Highlight – Cost
 Mini LED Backlight Product Highlight – Brightness
 Mini LED Backlight Product Highlight – Contrast
 Mini LED Backlight Product Highlight – Reliability
 Mini LED Backlight Product Highlight – Slim
 Comparison on Competitiveness of Various Displays
Chapter 3 Mini LED Backlight Product Application and Trend
 Mini LED Backlight Module Display Processing Cost Structure
 Mini LED – Chip Processing Cost Analysis
 Mini LED – Die Bonding Processing Cost Analysis
 Mini LED – PCB Processing Cost Analysis
 Mini LED – Drive IC Processing Cost Analysis
 Mini LED Backlight Display Application Product Overview
 Mini LED Product Application Specification Overview
 Cellphone Application Market Development Trend
 Cellphone Application Market Cost Trend
 Tablet Application Market Development Trend
 Tablet Application Market Cost Trend
 NB Application Market Development Trend
 NB Application Market Cost Trend
 Automotive Display Application Market Development Trend
 Automotive Display Application Market Cost Trend
 MNT Application Market Development Trend
 MNT Application Market Cost Trend
 TV Application Market Development Trend
 TV Application Market Cost Trend
Chapter 4 Mini LED Technology and Challenge
 Mini LED Technology and Challenge
 Chip-Mini LED Chip Characteristics
 Chip-Mini LED Flip Chip Structure
 Chip-Mini LED Chip Light Shape Characteristics
 Chip-Mini LED Chip Challenge Stepper Image
 Probing and Sorting- Face Challenge Due to the Growth of Usage Volume
 Probing and Sorting- Mini LED Chip Binning Challenge
 Package-LED Package Technology Development Trend
 Package-CSP Classification and Technology Challenge
 Package-Mini LED Classification and Technology Challenge
 Package-Comparison of Difference between Mini LED and CSP
 SMT-Mini LED SMT Overview
 SMT-SMD vs Mini LED Size Comparison
 SMT-Mini LED SMT Problem Analysis
 SMT-Pick and Place Problem Analysis
 SMT-Mini LED Welding Technology Classification
 SMT-Surface Mount Technology-Solder Paste Process
 SMT-Solder Paste Processing Problem Analysis
 SMT-Surface Mount Technology-Metal Eutectic Process
 Color Conversion-Wide Color Gamut Display Solution Trend
 Color Conversion-Wide Color Gamut Display Solution Specifications
 Color Conversion- QD Backlight Display Technology Structure
 Color Conversion-QD Backlight Technology Development Trend
 Backplane-Display Backplane Structure
 Light Source Backplane- Material and Drive Mode Classification
 Light Source Backplane-Glass Substrate and Switch Component Characteristics
 Light Source Backplane- Comparison of Difference of PCB Substrates
 Light Source Backplane- Comparison of Backplane Technology Differences
 Drive-Mini LED Active and Passive Drive Analysis
 Drive-Mini LED Passive Drive Classification
 Drive-Mini LED Passive Drive Light Source Module-Scan Mode
 Drive-Mini LED Passive Drive Partition Drive IC Volume Evaluation
 Drive-Mini LED Active Drive Light Source Module
 Light Processing- Challenge in Uniformity of Mini LED Backlight
 Light Processing- Calibration of Mini LED Backlight Display Disuniformity
 Light Processing- Differential Analysis in Mini LED Image Splicing
 Thinning- Evolution of Mini LED Backlight Display Light Source
 Thinning- Mini LED Backlight Display Development Trend
 Thinning- Trends in the Thinning of Mini LED Backlight Displays
 Thinning- Challenge of Mini LED Backlight Display Thinning
Chapter 5 Mini LED Key Manufacturer News Analysis
 Mini LED Backlight Supply Chain Analysis
 Mini LED Sorting and Binning Equipment Manufacturer-SAULTECH
 Mini LED Die Bonding Equipment Manufacturer- ASM Equipment and Inspection Solution
 Mini LED Die Bonding Equipment Manufacturer- ASM in Industry 40
 Mini LED Die Bonder Equipment Manufacturer-K&S
 Mini LED Die Bonder Equipment Manufacturer-Rohinni
 Mini LED Light Source Backplane Manufacturer-UNIFLEX
 Mini LED Drive IC Manufacturer-Macroblock
Chapter 6 Mini LED Supply Chain and Manufacturer News Analysis
 Mini LED Backlight Application Products Overview
 Global Major Mini LED Backlight Manufacturers’ Supply Chain Analysis
 Regional Manufacturer News Analysis-Taiwan Companies
 Regional Manufacturer News Analysis – Mainland Chinese Companies


Further information, please contact:

 

Global Contact: 

Taipei:

 

Shenzhen:

Grace Li

Eric Chang

Paula Peng

Perry Wang

Graceli@trendforce.com

Eric.chang@trendforce.com

Paulapeng@trendforce.com

perrywang@trendforce.cn

+886-2-8978-6488 ext.916

+886-2-8978-6488 ext.822

+886-2-8978-6488 ext.820

+86-755-8283-8931 ext.6800

Get in touch with us