[News] TSMC Partners with ASE and Siliconware to Boost CoWoS Packaging Capacities

According to the news from Liberty Times Net, NVIDIA’s Q2 financials and Q3 forecasts have astounded the market, driven by substantial growth in their AI-centric data center operations. NVIDIA addresses CoWoS packaging supply issues by collaborating with other suppliers, boosting future capacity, and meeting demand. This move is echoed in South Korea’s pursuit of advanced packaging strategies.

South Korea’s Swift Pursuit on Advanced Packaging

The semiconductor industry highlights that the rapid development of generative AI has outpaced expectations, causing a shortage of advanced packaging production capacity. Faced with this supply-demand gap, TSMC has outsourced some of its capacity, with Silicon Interposer production being shared by facilities under the United Microelectronics Corporation and Siliconware Precision Industries. UMC has also strategically partnered with Siliconware Precision Industries, and Amkor’s Korean facilities have joined the ranks of suppliers to augment production capacity.

Due to equipment limitations, TSMC’s monthly CoWoS advanced packaging capacity is expected to increase from 10,000 units to a maximum of 12,000 units by the end of this year. Meanwhile, other suppliers could potentially raise their CoWoS monthly capacity to 3,000 units. TSMC aims to boost its capacity to 25,000 units by the end of next year, while other suppliers might elevate theirs to 5,000 units.

According to the source South Korean media, Samsung entered the scene, competing for advanced packaging orders against NVIDIA. South Korea initiated a strategic research project to rapidly narrow the gap in packaging technology within 5~7 years, targeting giants like TSMC, Amkor, and China’s JCET.

(Source: https://ec.ltn.com.tw/article/paper/1601162)