[News]The 2nm Semiconductor Foundry Race Between TSMC, Samsung, Rapidus Begins with an Equipment Battle

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While 2nm advanced semiconductor chips are yet to enter mass production, the battle for equipment among semiconductor foundries is already in full swing.

TSMC, Samsung, and Rapidus Make Their Moves

To ensure the smooth deployment of 2nm process technology, TSMC, Samsung, and Rapidus have all embarked on pursuits in the upstream equipment sector.

TSMC, on September 12th, announced its intention to acquire a 10% stake in IMS Nanofabrication, a subsidiary of Intel, for no more than $432.8 million. IMS specializes in the development and production of electron beam lithography machines, widely used in semiconductor manufacturing, optical component production, MEMS manufacturing, and more. Industry experts believe that TSMC’s acquisition of IMS will ensure the development of critical equipment technology and meet the supply requirements for the commercialization of 2nm.

On the other hand, Samsung previously acquired a 3% stake in ASML, still holding approximately 0.7% of ASML shares. Additionally, Samsung’s collaboration with ASML continues to deepen. Reports suggest that Samsung is preparing to secure production of the next-generation High-NA EUV lithography machine, with the prototype expected to be unveiled later this year and commercial availability in the following year.

As for the semiconductor newcomer, Rapidus, obtaining ASML’s support is essential, given that EUV is a vital technology for mass-producing chips below 5-7nm. The latest reports from Japanese media indicate that ASML will establish a technical support base in Hokkaido, Japan, in 2024 and dispatch about 50 engineers to assist in setting up EUV lithography equipment in Rapidus’ 2nm chip factory’s pilot production line, offering assistance in commissioning, maintenance, and inspection.

The development of the major manufacturers in 2nm will be revealed in 2025

Leading traditional semiconductor foundries TSMC and Samsung, along with the emerging player Rapidus, are all actively positioning themselves in the 2nm chip landscape. So, how are these three companies progressing?

TSMC is targeting the production of N2 technology by 2025. Reports from June indicated that TSMC is fully committed, initiating preliminary preparations for the trial production of 2nm chips. In July, the TSMC supply chain revealed that TSMC had informed equipment suppliers to begin deliveries of 2nm-related machinery starting in the third quarter of the following year. In September, media reports revealed that TSMC had formed a dedicated 2nm task force, aiming to achieve risk production next year and commence mass production by 2025.

In June, Samsung announced its latest foundry technology innovations and business strategies, unveiling detailed plans and performance levels for 2nm process mass production. They plan to apply the 2nm process to mobile applications by 2025, expanding to HPC and automotive electronics in 2026 and 2027, respectively.

According to Rapidus’ plan, trial production of 2nm chips is set to begin in 2025, with mass production slated for 2027. In July, Rapidus President Atsuyoshi Koike stated that operating a trial production line in 2025 and commencing mass production in 2027 is an ambitious goal, but progress is on track. He noted that once the company’s 2nm process products go into mass production, their unit price will be ten times that of current Japanese-produced logic semiconductors.

With this timeline, it appears that the 2nm chips from these three semiconductor giants will first make their debut in 2025. At that time, the competition for advanced 2nm processes is expected to become even more intense.

(Photo credit: TSMC)