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[News] With two October Investments, Big Fund Phase II Commits Nearly 19 Billion RMB
Since October, China’s National Integrated Circuit Industry Investment Fund Phase II (hereafter referred to as “Big Fund Phase II”) has made two significant investments.
First, it invested in JCET Group’s subsidiary, JCET Group Automotive Electronics (Shanghai) Co., Ltd. (hereafter referred to as “JCET Automotive Electronics”). Later, it invested in ChangXin Xinqiao Storage Technology Co., Ltd. (hereafter referred to as “ChangXin Xinqiao”).
Data reveals that since its establishment, Big Fund II has invested in nearly 40 companies, with a total investment exceeding ¥55 billion. Despite the semiconductor industry’s low point this year, Big Fund Phase II has remained active, particularly emphasizing “strengthening the supply chain.” This includes increasing investments in critical areas like semiconductor equipment and materials.
- Investing in ChangXin Xinqiao, Enhancing Storage Manufacturing
On October 26th, Big Fund II invested ¥14.5 billion to acquire a 33.14% stake in ChangXin Xinqiao.
According to industry sources, Changxin Xinqiao is one of the projects developed as part of the ChangXin Memory Technologies (CXMT), a collaboration between Hefei Municipal Government, CXMT, Overseas Chinese Town Holdings Company, and NAURA Technology Group Co. in 2019.
As per previous public announcements, the total investment in the CXMT Semiconductor Manufacturing Base exceeds 220 billion yuan. The project is situated in the Hefei Airport Economic Demonstration Zone and primarily focuses on the Changxin Memory project, involving the development of the entire upstream and downstream industrial chain.
Among these initiatives, the Changxin 12-inch storage memory wafer manufacturing base stands out with a total investment of 150 billion yuan, making it the largest single industrial project investment in Anhui Province.
Additionally, according to information on Changxin Memory’s official website, their core product is DDR4 memory chips, which belong to the fourth generation of double data rate synchronous dynamic random-access memory (SDRAM).
2. Increasing Investment in JCET Group’s Subsidiary: Automotive Electronics Focus
On October 27th, JCET Group’s subsidiary, JCET Group Automotive Electronics, received a total capital injection of 4.4 billion yuan from a combination of new and existing shareholders, further emphasizing its commitment to the development of in-vehicle technology. This infusion of capital will accelerate the construction of its first-phase project for manufacturing and testing automotive chips.
After this capital injection, the subsidiary’s registered capital increased from ¥400 million to ¥4.8 billion, remaining a subsidiary of JCET Group. JCET Group Management’s ownership will be diluted to 55%, while Big Fund Phase II will hold an 18% stake.
JCET Group stated that this capital injection is primarily intended for the construction and operation of the target company, aligning with the company’s strategic plans and business development requirements.It aims to better serve the continuously growing market and customer demands, especially in strengthening the company’s automotive electronics business.
Currently, the company’s financial health is robust, and it believes that this capital infusion will not significantly impact its liquidity.
3. Big Fund Phase II Focuses on “Strengthening and Supplementing the Supply Chain” and Plays a Significant Role in the Down Cycle
The semiconductor industry has experienced significant performance fluctuations due to the ongoing semiconductor down cycle. In response to these challenges, Big Fund Phase II has become more active.
The fund has appeared on the shareholder lists of multiple semiconductor companies striving for initial public offerings (IPOs), including Hua Hong Semiconductor Limited, RYCHIP Semiconductor Inc., Guanggang Gases & Energy Company Limited, and Sinophorus Electronic Materials Co..
Notably, Big Fund Phase II has shown continued interest in Hua Hong Semiconductor Limited.
Hua Hong Semiconductor
On June 28, Hong Kong-listed Hua Hong Semiconductor (now known as Hua Hong Corporation) disclosed that it had signed a subscription agreement with the National Integrated Circuit Industry Investment Fund Phase II . Big Fund Phase II would participate as a strategic investor in subscribing to the company’s shares for its Sci-Tech Innovation Board IPO. The total subscription amount would not exceed 30 billion yuan.
On January 18 of the same year, Hua Hong Semiconductor announced that the company, along with HHGrace, and Big Fund Phase II, had entered into a joint venture agreement. They planned to establish a joint venture company and invest a total of $4.02 billion in cash into the joint venture company, which would be engaged in the manufacturing and sale of 12-inch wafers. Big Fund Phase II’s investment amount in this venture was $1.166 billion.
Silan Microelectronics Co.
Silan Microelectronics Co. has also attracted significant attention from Big Fund Phase II. On August 28th, Silan Microelectronics announced its intention to jointly invest 1.2 billion RMB with affiliated company Big Fund Phase II and non-affiliated entity HaiChuang Development Fund to subscribe for newly increased registered capital of 1.19 billion RMB in the affiliated joint-stock company, Xiamen Silan Advanced Compound Semiconductor Co., Ltd.. Silan Microelectronics is set to acquire controlling interest in Xiamen Silan Advanced Compound Semiconductor, while Big Fund Phase II will hold a 14.11% stake.
Publicly available information indicates that Xiamen Silan Advanced Compound Semiconductor revolves around the manufacture of compound semiconductor chips. In July of the previous year, the company initiated the “SiC Power Device Production Line Construction Project.”
This project entails an investment plan of 1.5 billion RMB to construct a 6-inch SiC power device chip production line. Ultimately, it aims to achieve an annual production capacity of 144,000 pieces of 6-inch SiC power device chips, comprising 120,000 pieces/year of SiC-MOSFET chips and 24,000 pieces/year of SiC-SBD chips.
China Resources Microelectronics Limited
On August 15, it was announced that the company’s subsidiary, Runpeng Semiconductor, plans to increase capital and introduce external investors, including Big Fund Phase II. Following the completion of this transaction, Runpeng Semiconductor’s registered capital will increase from 2.4 billion RMB to 15 billion RMB.
The announcement indicates that the external investors that Runpeng Semiconductor intends to introduce include 12 institutions, including Big Fund Phase II. Big Fund Phase II is committed to subscribing to a registered capital of 3.75 billion RMB.
In addition, the upstream semiconductor materials sector has also attracted the attention of Big Fund Phase II. In late March of this year, Jingrui announced that its subsidiary, Hubei Jingrui, plans to introduce strategic investors through capital expansion. Big Fund Phase II, among others, is set to inject 160 million yuan in cash into Hubei Jingrui.
Summary
Overall, Big Fund Phase II’s investments span the entire integrated circuit industry chain. However, it’s worth noting that compared to Big Fund Phase I, Big Fund Phase II places more emphasis on strengthening and supplementing the supply chain.
It has increased investments in critical areas such as upstream semiconductor equipment, materials, and shows optimism towards emerging hot sectors like AI and automotive electronics.
(Photo credit: Pixabay)
