According to TechNews’ report, during a recent financial conference, Samsung revealed its plans to diversify its sales structure by expanding its clientele in the fields of artificial intelligence semiconductors and automotive, moving away from its previous heavy reliance on the mobile sector.
As of 2023, it is understood that Samsung’s foundry sales distribution includes 54% from mobile, 19% from high-performance computing, and 11% from automotive.
According to a report from Wccftech, senior executives at Samsung have indicated that major players such as super-scale data centers, automotive original equipment manufacturers (OEMs), and other clients have been in contact with Samsung, considering the adoption of Samsung’s foundry services to manufacture their designed chips.
This includes the in-development 4-nanometer artificial intelligence accelerator and the 5-nanometer chips for the top-ranked electric vehicle company. Currently, Samsung is gearing up with its advanced packaging solution called SAINT (Samsung Advanced Interconnection Technology), aiming to compete with TSMC’s advanced packaging, CoWoS. Based on information disclosed by Samsung, there might be a collaboration with AMD in the field of artificial intelligence, involving the manufacturing of certain chips.
In fact, recent rumors suggest that Samsung has already reached an agreement with AMD to provide HBM3 and packaging technology for the upcoming Instinct MI300 series. Additionally, AMD might adopt a dual-sourcing strategy for the Zen 5 series architecture, choosing TSMC’s 3-nanometer process and Samsung’s 4-nanometer process technology for manufacturing the next-generation chips.
According to sources, besides the artificial intelligence domain, Samsung is likely to have received orders from the electric vehicle giant Tesla. The speculation points towards the possibility of fulfilling orders for Tesla’s next-generation HW 5.0 chip, designed for fully autonomous driving applications.
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(Photo credit: Samsung)