[News] NVIDIA and AMD Clash in AI Chip Market, as TSMC Dominates Orders with Strong Momentum in Advanced Processes

---

---

In the intense battle of AI chips between NVIDIA and AMD this year, AMD’s MI300 has entered mass production and shipment 1H24, gaining positive adoption from clients. In response, NVIDIA is gearing up to launch upgraded AI chips. TSMC emerges as the big winner by securing orders from both NVIDIA and AMD.

Industry sources have revealed optimism as NVIDIA’s AI chip shipment momentum is expected to reach around 3 million units this year, representing multiple growth compared to 2023.

With the production ramp-up of the AMD MI300 series chips, the total number of AI high-performance computing chips from NVIDIA and AMD for TSMC in 2024 is anticipated to reach 3.5 million units. This boost in demand is expected to contribute to the utilization rate of TSMC’s advanced nodes.

According to a report from the Economic Daily News, TSMC has not commented on rumors regarding customers and orders.

Industry sources have further noted that the global AI boom ignited in 2023, and 2024 continues to be a focal point for the industry. A notable shift from 2023 is that NVIDIA, which has traditionally dominated the field of high-performance computing (HPC) in AI, is now facing a challenge from AMD’s MI300 series products, which have begun shipping, intensifying competition for market share.

Reportedly, the AMD MI300A series products have commenced mass production and shipment this quarter. The central processing unit (CPU) and graphics processing unit (GPU) tile are manufactured using TSMC’s 5nm process, while the IO tile use TSMC’s 6nm process.

These chips are integrated through TSMC’s new System-on-Integrated-Chip (SoIC) and Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technologies. Additionally, AMD’s MI300X, which does not integrate the CPU, is also shipping simultaneously.

Compared to NVIDIA’s GH200, which integrates CPU and GPU, and the H200, focusing solely on GPU computation, AMD’s new AI chip performance exceeds expectations. It offers a lower price and a high cost-performance advantage, attracting adoption by ODMs.

In response to strong competition from AMD, NVIDIA is upgrading its product line. Apart from its high-demand H200 and GH200, NVIDIA is expected to launch new products such as B100 and GB200, utilizing TSMC’s 3nm process, by the end of the year.

Read more

• [News] Nvidia vs. AMD, the Expensive Duel as Two Major Buyers Opt for AMD’s Latest AI GPU
• [News] TSMC’s CoWoS Demand Surges from NVIDIA, Apple, AMD, Broadcom, Marvell, Monthly Capacity Up 120% in 2024

(Photo credit: NVIDIA)