[News] Samsung Bullish on Glass Substrate Applications, Setting Up Production Line for Mass Production Starting in 2026

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Samsung, as per a report from the global media outlet wccftech, has decided to enter the next generation of packaging technology by commencing R&D works for the adoption of “Glass Substrate” by 2026.

The report further indicates that Samsung’s preparation to enter the glass substrate industry for advanced packaging is not actually a new endeavor. As several years ago, competitor Intel had already made strides in this area. The commencement of significant production is expected to begin around 2030. In preparation for large-scale production, Intel has already begun establishing production lines in Arizona, investing USD 1 billion.

To address the current market’s capacity gap, Samsung has also initiated plans to commence glass substrate production.

Currently, under the Samsung Group umbrella, Samsung Electronics is in the process of implementing construction plans for production lines and is also conducting research and development on the application of glass substrates in the field of AI chips.

Additionally, Samsung Group is coordinating various departments within its conglomerate, such as Samsung Display, to further ensure the smooth completion of research and development as well as production efforts related to glass substrates.

The report indicates that through the application of advanced packaging technology using glass substrates, there are several advantages over traditional organic substrate packaging techniques, and it can overcome more technical bottlenecks.

For instance, glass substrates can offer higher strength, ensuring greater durability and reliability, as well as higher interconnectivity. Moreover, glass substrates are thinner than typical organic substrates, enabling the linking of more small chips in advanced packaging technology.

Previously, Intel also elaborated on the glass-based substrate packaging technology. According to Intel’s previous press release, glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus for lithography, and have the dimensional stability needed for extremely tight layer-to-layer interconnect overlay. As a result of these distinctive properties, a 10x increase in interconnect density is possible on glass substrates. Further, improved mechanical properties of glass enable ultra-large form-factor packages with very high assembly yields.

However, despite the many application advantages of glass substrates in the current market, the R&D efforts of various companies have encountered difficulties, impacting the market’s application status.

Currently, Samsung Electronics expects to mass-produce glass substrate products in 2026. Whether it can replace traditional organic substrates and advance packaging technology development will be a focal point of market attention.

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(Photo credit: Intel)