According to a report from the South Korean newspaper “Korea Joongang Daily,” following Micron’s initiation of mass production of the latest high-bandwidth memory HBM3e in February 2024, it has recently secured an order from NVIDIA for the H200 AI GPU. It is understood that NVIDIA’s upcoming H200 processor will utilize the latest HBM3e, which are more powerful than the HBM3 used in the H100 processor.
The same report further indicates that Micron secured the H200 order due to its adoption of 1b nanometer technology in its HBM3e, which is equivalent to the 12-nanometer technology used by SK Hynix in producing HBM. In contrast, Samsung Electronics currently employs 1a nanometer technology, which is equivalent to 14-nanometer technology, reportedly lagging behind Micron and SK Hynix.
The report from Commercial Times indicates that Micron’s ability to secure the NVIDIA order for H200 is attributed to the chip’s outstanding performance, energy efficiency, and seamless scalability.
As per a previous report from TrendForce, starting in 2024, the market’s attention will shift from HBM3 to HBM3e, with expectations for a gradual ramp-up in production through the second half of the year, positioning HBM3e as the new mainstream in the HBM market.
TrendForce reports that SK Hynix led the way with its HBM3e validation in the first quarter, closely followed by Micron, which plans to start distributing its HBM3e products toward the end of the first quarter, in alignment with NVIDIA’s planned H200 deployment by the end of the second quarter.
Samsung, slightly behind in sample submissions, is expected to complete its HBM3e validation by the end of the first quarter, with shipments rolling out in the second quarter. With Samsung having already made significant strides in HBM3 and its HBM3e validation expected to be completed soon, the company is poised to significantly narrow the market share gap with SK Hynix by the end of the year, reshaping the competitive dynamics in the HBM market.
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(Photo credit: Micron)