As TSMC and Intel slow down their plans for building fabs in the United States, the supply chain, according to a report from Nikkei Asia, is also said to delay in following suit, with semiconductor material suppliers like Topco Scientific, LCY Chemical, and Chang Chun Group among those named.
Per the same report citing statements from several industry sources, the construction of these fabs has been either postponed or significantly scaled back due to soaring costs of construction materials and labor, as well as a shortage of construction workers.
While some delays may be temporary, other fab construction projects are being thoroughly reassessed, with no specific timetable for resuming. Suppliers attribute the delays in fab construction plans to the slower-than-expected progress of Intel and TSMC in setting up their facilities.
The sources cited in the report also revealed that Solvay, a leading supplier of high-purity hydrogen peroxide for semiconductor use based in Belgium, has postponed the construction of its Arizona plant due to cost concerns and fears that Intel and TSMC’s expansion progress may take longer than expected.
Meanwhile, another major manufacturer of high-purity hydrogen peroxide for semiconductors, Taiwan’s Chang Chun Group, has significantly scaled back the construction of its new Arizona plant due to costs that have exceeded expectations by several times.
Regarding this issue, Chang Chun Group reportedly opted not to provide comments, while Solvay mentioned they are currently investigating the matter.
Topco Scientific has reportedly pointed out that it has acquired land in Arizona, USA. However, the company is currently adjusting its investment schedule for warehouse logistics in Arizona. This adjustment aligns with the progress and demand of its customers in setting up factories, as well as the local infrastructure planning, which includes water and power supply and road construction.
Per the report citing sources, TSMC originally planned to begin mass production at its Arizona plant in 2024. However, this timeline has now been postponed to 2025. Initial expectations for the second fab’s schedule were set for 2026, but it is now likely to be pushed back to 2027-2028
As per a previous report from TechNews, despite the United States outperforms Taiwan in various aspects for foundry construction, the primary obstacle is regulatory issues.
Due to the unique federal structure of the United States, foundry construction must comply with federal, state, and local regulations, resulting in an exceptionally complex regulatory process. Additionally, environmental policies pose obstacles to foundry construction, particularly due to stringent requirements for environmental protection
The report suggests that to enhance the United States’ competitiveness in the global semiconductor industry, the government needs to streamline regulatory processes, eliminate redundant regulations, and establish expedited pathways to accelerate semiconductor industry construction projects.
Additionally, there should be an acceleration of environmental review processes and investment in the development of alternative materials to ensure sustainable semiconductor material supplies.
With the continued growth in global semiconductor demand, the construction speed and efficiency of US semiconductor fabs will directly impact its position in the global market.
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(Photo credit: TSMC)