[News] Samsung Reportedly Commits to Advanced Packaging, Targets Over USD100 Million in Related Revenue This Year

---

---

Amid the AI boom driving a surge in demand for advanced packaging, South Korean semiconductor giant Samsung Electronics is aggressively entering the advanced packaging arena. On the 20th, it announced its ambitions to achieve record-high revenue in advanced packaging this year, aiming to surpass the USD 100 million mark.

According to reports from Reuters and The Korea Times, Samsung’s annual shareholders’ meeting took place on March 20th.

During the meeting, Han Jong-hee, the vice chairman of the company, stated as follows: “Although the macroeconomic environment is expected to be uncertain this year, we see an opportunity for increased growth through next-generation technology innovation.”

“Samsung plans to apply AI to all devices, including smartphones, foldable devices, accessories and extended reality (XR), to provide customers with a new experience where generative AI and on-device AI unfold,” Han added.

Samsung established the Advanced Package Business Team under the Device Solutions business group in December last year. Samsung Co-CEO Kye-Hyun Kyung stated that he expects the results of Samsung’s investment to come out in earnest from the second half of this year.

Kyung further noted that for a future generation of HBM chips called HBM4, likely to be released in 2025 with more customised designs, Samsung will take advantage of having memory chips, chip contract manufacturing and chip design businesses under one roof to satisfy customer needs.

According to a previous report from TrendForce, Samsung led the pack with the highest revenue growth among the top manufacturers in Q4 as it jumped 50% QoQ to hit $7.95 billion, largely due to a surge in 1alpha nm DDR5 shipments, boosting server DRAM shipments by over 60%. In the fourth quarter of last year, Samsung secured a market share of 45.5% in DRAM chips.

Read more

• [News] Samsung Accelerates 3D Packaging with Hybrid Bonding Production Line in Korean Advanced Packaging Hub
• DRAM Industry Sees Nearly 30% Revenue Growth in 4Q23 Due to Rising Prices and Volume, Says TrendForce

(Photo credit: Samsung)